Abstract: Embodiments in accordance with the present invention encompass compositions containing a polycycloolefinic polymer and at least one diazirine compound as described herein which when subjected to a suitable temperature or actinic radiation undergoes crosslinked network to form a three-dimensional insulating article which exhibits hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain hydrogenated tackifiers, which provide much improved adhesive properties and are suitable in a number of opto-electronic applications including copper-clad laminates, among others. The compositions of this invention are also useful as insulating materials in millimeter wave radar antennas, among others.

Abstract: Embodiments in accordance with the present invention encompass a composition comprising a polyamic acid or an end capped polyamic acid and a diazirine, which are useful as photosensitive compositions for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass copolymers, terpolymers and tetrapolymers of a variety of polycycloolefinic monomers at least one of which monomer contains an unpolymerized acrylate group. In further aspect of this invention there is provided an embodiment encompassing compositions containing the polymers of this invention, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. There is also provided a mass polymerizable composition encompassing one or more polycycloolefinic monomers optionally containing a monomer with an acrylate group and/or a crosslinking agent containing multi-functional acrylate. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties.

Abstract: Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers optionally at least one of which monomer contains an additional unpolymerized ethylenic bond, organophosphorus compound, optionally hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire retardancy and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to excellent thermal and dielectric properties.

Abstract: Embodiments in accordance with the present invention encompass copolymers and terpolymers of a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond. In further aspect of this invention there is provided an embodiment encompassing compositions containing the polymers of this invention, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties.

Abstract: Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, hexagonal boron nitride, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties.

Abstract: Embodiments in accordance with the present invention encompass compositions containing one or more polycycloolefinic monomers and at least one multifunctional olefinic monomer which when subjected to a suitable temperature undergoes mass polymerization to provide a three-dimensional insulating article which exhibits hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions are stable at room temperature and undergo mass polymerization only when subjected to suitable higher temperatures generally above 100° C. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.

Abstract: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass compositions containing one or more polycycloolefinic monomers, optionally at least one multifunctional olefinic monomer and a suitable solvent, which exhibits long shelf life stability and undergoes mass polymerization only when subjected to a suitable temperature to provide a three-dimensional insulating articles. Embodiments of this invention exhibit hitherto unattainable properties, such as for example, low dielectric constant and low loss properties, and very high thermal properties, among others. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. In general the compositions are stable at room temperature for an extended period of time lasting up to a few weeks and undergo mass polymerization only when subjected to suitable higher temperatures generally above 100° C.

Abstract: Embodiments in accordance with the present invention encompass compositions containing one or more polycycloolefinic monomers and at least one multifunctional olefinic monomer which when subjected to a suitable temperature undergoes mass polymerization to provide a three-dimensional insulating article which exhibits hitherto unattainable low dielectric constant and low-loss properties, and very high thermal properties. The compositions of this invention may additionally contain one or more organic or inorganic filler materials, which provide improved thermo-mechanical properties in addition to very low dielectric properties. The compositions are stable at room temperature and undergo mass polymerization only when subjected to suitable higher temperatures generally above 100° C. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others.

Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments encompassing a series of compositions containing photoacid generator (PAG) and a base are disclosed and claimed. The compositions are useful as permanent dielectric materials. More specifically, embodiments encompassing compositions containing a series of copolymers of a variety of norbornene-type cycloolefinic monomers and maleic anhydride in which maleic anhydride is fully or partially hydrolyzed (i.e., ring opened and fully or partially esterified), PAG and a base, which are useful in forming permanent dielectric materials having utility in a variety of electronic material applications, among various other uses, are disclosed.

Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass photosensitive compositions containing a variety of soluble polyimide polymers and various additives including photoacid generator, photo radical generator and one or more photo crosslinking agents which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom can be readily cured at lower temperatures than the conventional polyimides and exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive maleimide end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass self-imageable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.

Abstract: Embodiments in accordance with the present invention encompass self-imageable polymer compositions containing a variety of photobase generators which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. The compositions of this invention can be tailored to form positive tone or negative tone images depending upon the intended application in aqueous developable medium. The images formed therefrom exhibit improved properties including low wafer stress and better thermo-mechanical properties, among other property enhancements.