Patents by Inventor Pramod Kumar Pandey

Pramod Kumar Pandey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High flux X-ray target and assembly
    Patent number: 7852988
    Abstract: An X-ray tube anode assembly and an X-ray tube assembly are disclosed that include an X-ray target and a drive assembly configured to provide an oscillatory motion to the X-ray target. The drive assembly is configured to provide an oscillatory motion to the target assembly.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 14, 2010
    Assignee: General Electric Company
    Inventors: Manoharan Venugopal, Anandraj Sengupta, Mandyam Rangayan Sridhar, Maheshwara Murthy, Rammohan Rao Kalluri, Thangavelu Asokan, Ramasamy Anbarasu, Pramod Kumar Pandey, Clarence Lavere Gordon, III, Mark Alan Frontera, Sunil Srinivasa Murthy, Debasish Mishra, Manoj Kumar Koyithitta Meethal, Munishwar Ahuja, Hombe Gowda
  • Process for preparing an aerated food product comprising protein and fiber
    Patent number: 7700144
    Abstract: A process of making an aerated food product comprising protein and fiber is described.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: April 20, 2010
    Assignee: Nellson Nutraceutical LLC
    Inventors: Pramod Kumar Pandey, Julia Maria Guerrero, Margaret Ciaston
  • HIGH FLUX X-RAY TARGET AND ASSEMBLY
    Publication number: 20100027753
    Abstract: An X-ray tube anode assembly and an X-ray tube assembly are disclosed that include an X-ray target and a drive assembly configured to provide an oscillatory motion to the X-ray target. The drive assembly is configured to provide an oscillatory motion to the target assembly.
    Type: Application
    Filed: July 31, 2008
    Publication date: February 4, 2010
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: Manoharan Venugpal, Anandraj Sengupta, Mandyam Rangayam Sridhar, Maheshwara Murthy, Rammohan Rao Kalluri, Thangavelu Asokan, Ramasamy Anbarusu, Pramod Kumar Pandey, Clarence Lavere Gordon, III, Mark Alan Frontera, Sunil Srinivasa Murthy, Debasish Mishra, Manoj Kumar Koyithitta Meethal, Munishwar Ahuja, Hombe Gowda
  • PROCESSES FOR PURIFYING VARENICLINE L-TARTRATE SALT AND PREPARING CRYSTALLINE FORMS OF VARENICLINE L-TARTRATE SALT
    Publication number: 20100010221
    Abstract: Processes for purifying Varenicline base or the L-tartrate salt thereof and for preparing Varenicline L-tartrate crystalline forms A and B are provided.
    Type: Application
    Filed: May 28, 2009
    Publication date: January 14, 2010
    Inventors: Revital Lifshitz-Liron, Shalom Shabat, Sharon Tomer, Yuriy Raizi, Eyal Gilboa, Pramod Kumar Pandey
  • Method and system for controlling bandwidth allocation
    Patent number: 7551558
    Abstract: A Ethernet switch 1 includes a monitoring unit 9 for policing the amount of traffic on each of a plurality of flows or groups of flows. The monitoring unit has a memory, implemented in hardware as a RAM memory, having a section of each of the flows or groups of flows, and acting as a token bucket for those flows or group of flows.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: June 23, 2009
    Assignee: Infineon Technologies AG
    Inventors: Shridhar Mubaraq Mishra, Pramod Kumar Pandey, Guruprasad Ardhanari
  • Semiconductor chip and a lead frame
    Patent number: 6495925
    Abstract: A semiconductor chip includes a semiconductor substrate having an electronic circuit theron and a number of bond pads thereon. The bond pads are coupled to the electronic circuit and permit power to be supplied to the electronic circuit and signals to be input to and output from the electronic circuit. The bond pads are arranged on the surface of the substrate such that at least some of the pads are separated from the edge of the substrate by other bond pads. A lead frame is also provided in which two of the contact pins are electrically coupled to each other by a contact strip which extends along at least a portion of an edge of a die pad. The contact strip is located between the die pad and some of the other contact pins.
    Type: Grant
    Filed: January 4, 2002
    Date of Patent: December 17, 2002
    Assignee: Infineon Technologies A.G.
    Inventors: Choon Muah Patricia Lee, Soong Ooi Yong, Pramod Kumar Pandey, Chong Hsu Liu