Patents by Inventor Pranabes K. Pramanik
Pranabes K. Pramanik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9669992Abstract: A mold includes a forming insert that includes an upper portion and a lower portion. The upper portion includes a sidewall segment and a heel segment extending from a bottom of the sidewall segment. The sidewall segment has a sidewall radius, and the heel segment has a heel radius that is less than the sidewall radius. The lower portion extends axially downward from the upper portion to define a base cavity. A forming base is positionable within the base cavity. The rim has a rim radius that is less than the heel radius and the step has a step radius that is less than the rim radius.Type: GrantFiled: July 21, 2015Date of Patent: June 6, 2017Assignee: Polyone Designed Structures and Solutions LLCInventors: Loren F. Temple, Jr., Pranabes K. Pramanik
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Patent number: 8866018Abstract: A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.Type: GrantFiled: January 12, 2009Date of Patent: October 21, 2014Assignee: Oak-Mitsui Technologies LLCInventors: Pranabes K. Pramanik, Yuji Kageyama, Fujio Kuwako, Jin Hyun Hwang
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Publication number: 20140170344Abstract: A multi-layer sheet structure is provided. The multi-layer sheet structure comprises at least one structural layer comprising high impact polystyrene and at least one moisture barrier layer comprising greater than about 30 percent cyclic olefin copolymer by weight of the at least one moisture barrier layer.Type: ApplicationFiled: February 18, 2013Publication date: June 19, 2014Applicant: SPARTECH CORPORATIONInventors: Pranabes K. Pramanik, Gregory M. Dixon
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Publication number: 20120241352Abstract: A container includes a body that includes a sidewall and a heel extending from a bottom of the sidewall. The sidewall defines a cavity therein. The sidewall has a sidewall radius, and the heel has a heel radius that is less than the sidewall radius. A base is coupled to the heel. The container is molded from a multi-layer sheet structure including a polypropylene composition that enables the body to be substantially rigid while the base is being punctured by a puncturing device.Type: ApplicationFiled: September 1, 2011Publication date: September 27, 2012Inventors: Pranabes K. Pramanik, Loren F. Temple, JR.
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Publication number: 20120244362Abstract: A multi-layer sheet structure includes, in an exemplary embodiment, a barrier layer having a first side and a second side, at least one thermoplastic layer on the first side of the barrier layer, and at least one thermoplastic layer on the second side of the barrier layer. A cup shaped container may be molded from the multi-layer sheet structure.Type: ApplicationFiled: September 1, 2011Publication date: September 27, 2012Inventors: Pranabes K. Pramanik, Jeffrey J. Berg
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Patent number: 7862900Abstract: The invention concerns multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. A thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.Type: GrantFiled: August 26, 2009Date of Patent: January 4, 2011Assignee: Oak-Mitsui Inc.Inventors: John A. Andresakis, Pranabes K. Pramanik
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Publication number: 20100175914Abstract: A thin laminate passive electrical device, such as, a capacitor, and a method of fabricating a thin laminate passive electrical device are provided. The passive electrical device includes two conductors, for example, copper foil conductors, separated by a dielectric having a first layer of a first material having a softening point temperature greater than a first temperature and a first layer of a second material having a softening point temperature less than the first temperature. The first temperature may be at least 150 degrees C. or higher. By providing a first layer having a higher softening point material, shorting across the conductors, that can be promoted by the fabrication process, is prevented. Methods of fabricating passive electrical devices are also disclosed.Type: ApplicationFiled: January 12, 2009Publication date: July 15, 2010Applicant: OAK-MITSUI TECHNOLOGIES LLCInventors: Pranabes K. PRAMANIK, Yuji KAGEYAMA, Fujio KUWAKO, Jin Hyun HWANG
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Patent number: 7672113Abstract: Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about ?55° C. to about 125° C. Specifically, these capacitor materials have a change in TCC ranging from about ?5% to about +5%, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.Type: GrantFiled: September 14, 2007Date of Patent: March 2, 2010Assignee: Oak-Mitsui, Inc.Inventors: Pranabes K. Pramanik, Jaclyn Radewitz, Kazuhiro Yamazaki
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Publication number: 20090314531Abstract: The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.Type: ApplicationFiled: August 26, 2009Publication date: December 24, 2009Inventors: JOHN A. ANDRESAKIS, Pranabes K. Pramanik
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Patent number: 7596842Abstract: The invention concerns a method of making multilayered constructions useful in forming capacitors and resistors, which may be used in the manufacture of printed circuit boards and microelectronic devices. According to the inventive method, a thermosetting polymer layer or layers are attached directly onto a heat resistant film layer, specifically on the side(s) of the heat resistant film to be attached to an electrically conductive layer having an electrical resistance material layer thereon. Attaching the adhesive to the heat resistant film rather than the electrically conductive layer streamlines the manufacturing process, particularly in the formation of the electrical resistance material layer onto the electrically conductive layer. This also results in better precision and uniformity of the multilayered construction.Type: GrantFiled: February 22, 2005Date of Patent: October 6, 2009Assignee: Oak-Mitsui Inc.Inventors: John A. Andresakis, Pranabes K. Pramanik
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Publication number: 20090073636Abstract: Polymer-ceramic composite materials for use in the formation of capacitors, which materials exhibit very low changes in temperature coefficient of capacitance (TCC) in response to changes in temperature within the range of from about ?55° C. to about 125° C. Specifically, these capacitor materials have a change in TCC ranging from about ?5 % to about +5 %, in response to changes in temperature within the desired temperature range. The inventive composite materials comprise a blend of a polymer component and ferroelectric ceramic particles, wherein the polymer component includes at least one epoxy-containing polymer, and at least one polymer having epoxy-reactive groups. The inventive polymer-ceramic composite materials have excellent mechanical properties such as improved peel strength and lack of brittleness, electrical properties such as high dielectric constant, and improved processing characteristics.Type: ApplicationFiled: September 14, 2007Publication date: March 19, 2009Inventors: PRANABES K. PRAMANIK, Jaclyn Radewitz, Kazuhiro Yamazaki
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Publication number: 20080226815Abstract: The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.Type: ApplicationFiled: May 23, 2008Publication date: September 18, 2008Inventor: PRANABES K. PRAMANIK
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Patent number: 7413815Abstract: The invention concerns multilayered structures useful for forming capacitors, which may be embedded within printed circuit boards or other microelectronic devices. The multilayered structure comprises a pair of parallel electrically conductive layers separated by a pair of dielectric layers and a central polymerizable layer. Each of the dielectric layers and the central layer may include a filler. Capacitors formed from the multilayered structures of the invention exhibit excellent short circuit resistance as well as excellent void resistance.Type: GrantFiled: February 19, 2004Date of Patent: August 19, 2008Assignee: Oak-Mitsui Inc.Inventor: Pranabes K. Pramanik
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Patent number: 7192654Abstract: The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.Type: GrantFiled: February 22, 2005Date of Patent: March 20, 2007Assignees: Oak-Mitsui Inc., Ohmega Technologies Inc.Inventors: John A. Andresakis, Pranabes K. Pramanik, Bruce Mahler, Daniel Brandler