Patents by Inventor Pranav K. Desai

Pranav K. Desai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High performance transient uniform cooling solution for thermal compression bonding process
    Patent number: 9943931
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 17, 2018
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20170014957
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Application
    Filed: July 27, 2016
    Publication date: January 19, 2017
    Applicant: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • High performance transient uniform cooling solution for thermal compression bonding process
    Patent number: 9434029
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: September 6, 2016
    Assignee: Intel Corporation
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha
  • HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20130299133
    Abstract: Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
    Type: Application
    Filed: December 20, 2011
    Publication date: November 14, 2013
    Inventors: Zhihua Li, Hemanth K. Dhavaleswarapu, Joseph B. Petrini, Shankar Devasenathipathy, Steven B. Roach, Ioan Sauciuc, Pranav K. Desai, George S. Kostiew, Sanjoy K. Saha