Abstract: Methods and systems for optically determining the performance of active components of a device under test (DUT). A portion of the DUT that includes a target active component and an additional active component is illuminated and reflected energy from the target active component and the additional active component is detected by one or more sensors. An analog signal that corresponds to the reflected energy is generated by a processor. An estimated target signal determined based on the analog signal and the second analog signal, where the estimated target signal corresponds to an estimated component of the analog signal that is attributable to the target reflected energy reflected by the target active component. The estimated target signal is then used to determine the performance of the target active component of the DUT.

Abstract: An optics arrangement for a solid immersion lens (SIL) is disclosed. The arrangement enables the SIL to freely tilt. The arrangement includes a SIL having an optical axis extending from an engaging surface and a rear surface of the SIL; a SIL housing having a cavity configured to accept the SIL therein while allowing the SIL to freely tilt within the cavity, wherein the cavity includes a hole positioned such that the optical axis passes there-through, to thereby allow light collected by the SIL to propagate to an objective lens; and, a SIL retainer attached to the SIL housing and configured to prevent the SIL from exiting the cavity.

Abstract: An apparatus and method for optical probing of a DUT is disclosed. The system enables identifying, localizing and classifying faulty devices within the DUT. A selected area of the DUT is imaged while the DUT is receiving test signals, which may be static or dynamic, i.e., causing certain of the active devices to modulate. Light from the DUT is collected and is passed through a rotatable diffracting element prior to imaging it by a sensor and converting it into an electrical signal. The resulting image changes depending on the rotational positioning of the grating. The diffracted image is inspected to identify, localize and classify faulty devices within the DUT.

Abstract: An optics arrangement for a solid immersion lens (SIL) is disclosed. The arrangement enables the SIL to freely tilt. The arrangement includes a SIL having an optical axis extending from an engaging surface and a rear surface of the SIL; a SIL housing having a cavity configured to accept the SIL therein while allowing the SIL to freely tilt within the cavity, wherein the cavity includes a hole positioned such that the optical axis passes there-through, to thereby allow light collected by the SIL to propagate to an objective lens; and, a SIL retainer attached to the SIL housing and configured to prevent the SIL from exiting the cavity.

Abstract: An optics arrangement for a solid immersion lens (SIL) is disclosed. The arrangement enables the SIL to freely tilt. The arrangement includes a SIL having an optical axis extending from an engaging surface and a rear surface of the SIL; a SIL housing having a cavity configured to accept the SIL therein while allowing the SIL to freely tilt within the cavity, wherein the cavity includes a hole positioned such that the optical axis passes there-through, to thereby allow light collected by the SIL to propagate to an objective lens; and, a SIL retainer attached to the SIL housing and configured to prevent the SIL from exiting the cavity.

Abstract: An apparatus and method for optical probing of a DUT is disclosed. The system enables identifying, localizing and classifying faulty devices within the DUT. A selected area of the DUT is imaged while the DUT is receiving test signals, which may be static or dynamic, i.e., causing certain of the active devices to modulate. Light from the DUT is collected and is passed through a rotatable diffracting element prior to imaging it by a sensor and converting it into an electrical signal. The resulting image changes depending on the rotational positioning of the grating. The diffracted image is inspected to identify, localize and classify faulty devices within the DUT.

Abstract: An apparatus and method for optical probing of a DUT is disclosed. The system enables identifying, localizing and classifying faulty devices within the DUT. A selected area of the DUT is imaged while the DUT is receiving test signals, which may be static or dynamic, i.e., causing certain of the active devices to modulate. Light from the DUT is collected and is passed through a rotatable diffracting element prior to imaging it by a sensor and converting it into an electrical signal. The resulting image changes depending on the rotational positioning of the grating. The diffracted image is inspected to identify, localize and classify faulty devices within the DUT.

Abstract: A method of obtaining two orthogonally polarized super-resolution images is provided. A first diffraction-limited image is obtained using horizontally polarized light; a second diffraction-limited image is obtained using vertically polarized light; and, the first and second images are processed so as to yield a convoluted image having super diffraction-limited performance in both dimensions. Enhanced alignment of CAD image to acquired image is facilitated using the horizontally and vertically polarized images.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: An optics arrangement for a solid immersion lens (SIL) is disclosed. The arrangement enables the SIL to freely tilt. The arrangement includes a SIL having an optical axis extending from an engaging surface and a rear surface of the SIL; a SIL housing having a cavity configured to accept the SIL therein while allowing the SIL to freely tilt within the cavity, wherein the cavity includes a hole positioned such that the optical axis passes there-through, to thereby allow light collected by the SIL to propagate to an objective lens; and, a SIL retainer attached to the SIL housing and configured to prevent the SIL from exiting the cavity.

Abstract: An apparatus and method for optical probing of a DUT is disclosed. The system enables identifying, localizing and classifying faulty devices within the DUT. A selected area of the DUT is imaged while the DUT is receiving test signals, which may be static or dynamic, i.e., causing certain of the active devices to modulate. Light from the DUT is collected and is passed through a rotatable diffracting element prior to imaging it by a sensor and converting it into an electrical signal. The resulting image changes depending on the rotational positioning of the grating. The diffracted image is inspected to identify, localize and classify faulty devices within the DUT.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: A collection optics having variable magnification, and which enable changing magnification without stopping the spray cooling. The variable magnification is provided by a turret that carries several objectives of different magnifications. A frame is provided above the turret, wherein the spray cooling is provided. By rotating the turret and changing its elevation, different objectives of the turret can be “docked” to a docking port within the frame.

Abstract: Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.

Abstract: A collection optics having variable magnification, and which enable changing magnification without stopping the spray cooling. The variable magnification is provided by a turret that carries several objectives of different magnifications. A frame is provided above the turret, wherein the spray cooling is provided. By rotating the turret and changing its elevation, different objectives of the turret can be “docked” to a docking port within the frame.

Abstract: A light emission microscope includes a low temperature detector array which receives light through a room temperature projection optics system from a device under test. A cold aperture including a movable cold stop and a cryogenic filter absorbs unwanted thermal radiation emitted by the optics system. In one embodiment, a high resolution CCD camera can be used with the low temperature detector array and camera with a computer-controlled mirror providing emitted light to both cameras.

Abstract: Vibration damping apparatus for vibrating environment such as a light emission microscope and an integrated circuit test head includes a rigid member with remotely controlled clamping apparatus attached to spaced portions of the member. The clamping apparatus engage the microscope and the test head for reducing vibrations, and the clamping apparatus can be readily deactivated for moving the microscope or the test head for alignment purposes. Advantageously, two or more rigid members including pneumatic cylinders can be positioned around the device under test while permitting the use of mechanical probes for engaging nodes of an integrated circuit for test purposes.

Abstract: A light emission microscope includes a low temperature detector array which receives light through a room temperature projection optics system from a device under test. A cold aperture including a movable cold stop and a cryogenic filter absorbs unwanted thermal radiation emitted by the optics system. In one embodiment, a high resolution CCD camera can be used with the low temperature detector array and camera with a computer-controlled mirror providing emitted light to both cameras.