Abstract: The invention provides a nonwoven laminate, comprising in order (A) to (E): a spunbond nonwoven layer (A) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; an optional spunbond nonwoven layer (B) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (B) having a higher copolyester content than nonwoven layer (A); a needled staple fibre nonwoven layer (C), comprising: monocomponent polyethylene terephthalate (PET) staple fibres (c1), and multicomponent staple fibres (c2), which comprise at least a polyethylene terephthalate (PET) component and a copolyester component; an optional spunbond nonwoven layer (D) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (D) having a higher copolyester content than nonwoven layer (E); a spunbond nonwoven layer (E) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; wherein all layers are melt-bonded to each ot

Abstract: An embossed non-woven for the vehicle interior, includes: polyethylene terephthalate framework staple fibers; and polyethylene terephthalate binding staple fibers. A proportion of polyethylene terephthalate binding staple fibers is 5 to 50 wt. % based on a total weight of the non-woven. The polyethylene terephthalate binding staple fibers includes core/shell staple fibers. A shell of the core/shell staple fibers has low-melting co-polyethylene terephthalate having a melting point measured in accordance with DIN ISO 11357-3 (2013) in a range of 80° C. to 230° C.

Abstract: A network device having improved thermal cooling is provided. The network device includes a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

Abstract: A packaging for sterile packaging application includes: a single layer nonwoven fabric obtained from a nonwoven, the nonwoven including meltblown polymer fibers having an average fiber diameter between 2 ?m to 10 ?m and a standard deviation of the fiber diameter of at least 100%. The nonwoven is thermally bonded.

Abstract: A thermoformable decorative material for an automotive interior includes: a decorative layer including a textile substrate; a digitally printed design disposed on at least one side of the textile substrate and having dispersion ink and/or pigment ink; and an overlay adhesive coating applied to the digitally printed design. The overlay adhesive coating has an adhesive that includes polyurethane and/or polyacrylate.

Abstract: A packaging includes a composite material. The composite material includes a barrier layer and a backing layer. The backing layer includes a spunbonded nonwoven, arranged on at least one side of the barrier layer and bonded to the barrier layer by heat and pressure. The barrier layer includes a nonwoven containing 1 to 70 wt % melt-blown fibers and 30 to 99 wt % staple fibers, relative to a total weight of the nonwoven in each case.

Abstract: An embossed non-woven for the vehicle interior, includes: polyethylene terephthalate framework staple fibers; and polyethylene terephthalate binding staple fibers. A proportion of polyethylene terephthalate binding staple fibers is 5 to 50 wt. % based on a total weight of the non-woven. The polyethylene terephthalate binding staple fibers includes core/shell staple fibers. A shell of the core/shell staple fibers has low-melting co-polyethylene terephthalate having a melting point measured in accordance with DIN ISO 11357-3 (2013) in a range of 80° C. to 230° C.

Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

Abstract: Embodiments of the present disclosure provide a method and apparatus for reducing cross talk among pins in a connector. The apparatus may detect a bit error rate (BER) for each of a plurality of pins in a connector and compare the BER for each pin to a threshold BER. Responsive to determining that a set of pins among the plurality of pins each have a BER that is above the threshold BER, the apparatus may decrease the BER for each pin in the set of pins by selecting a subset of pins among the plurality of pins and adjusting operational characteristics of one or more of the subset of pins. The operational characteristics include a transmit power of the pin.

Abstract: A thermoformable decorative material for an automotive interior includes: a decorative layer including a textile substrate; a digitally printed design disposed on at least one side of the textile substrate and having dispersion ink and/or pigment ink; and an overlay adhesive coating applied to the digitally printed design. The overlay adhesive coating has an adhesive that includes polyurethane and/or polyacrylate.

Abstract: A cable harness includes a support frame configured to support a plurality of cables coupled to an electronic device. The cable harness also includes a tapered frame comprising a first end and a second end. The second end is smaller than the first end and the first end is coupled to the support frame. The cable harness further includes an attachment portion coupled to the tapered frame at the second end. The attachment portion is configured to attach the cable harness to the electronic device.

Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.

Abstract: The invention provides a nonwoven laminate, comprising in order (A) to (E): a spunbond nonwoven layer (A) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; an optional spunbond nonwoven layer (B) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (B) having a higher copolyester content than nonwoven layer (A); a needled staple fibre nonwoven layer (C), comprising: monocomponent polyethylene terephthalate (PET) staple fibres (c1), and multicomponent staple fibres (c2), which comprise at least a polyethylene terephthalate (PET) component and a copolyester component; an optional spunbond nonwoven layer (D) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (D) having a higher copolyester content than nonwoven layer (E); a spunbond nonwoven layer (E) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; wherein all layers are melt-bonded to each ot

Abstract: Embodiments of the present disclosure provide a method and apparatus for reducing cross talk among pins in a connector. The apparatus may detect a bit error rate (BER) for each of a plurality of pins in a connector and compare the BER for each pin to a threshold BER. Responsive to determining that a set of pins among the plurality of pins each have a BER that is above the threshold BER, the apparatus may decrease the BER for each pin in the set of pins by selecting a subset of pins among the plurality of pins and adjusting operational characteristics of one or more of the subset of pins. The operational characteristics include a transmit power of the pin.

Abstract: The invention refers to the use of a parent solution (A) during a method for producing fibers for a fiber fleece by a so-called solution blow spinning. Water is used as solvent for the parent solution (A). At least one water-soluble polymer and preferably exactly one water-soluble polymer is dissolved in the water of the parent solution (A). The parent solution (A) additionally contains at least one surfactant and optionally plasticizer for the used at least one polymer respectively. By means of a parent solution (A) it is possible to produce fibers (24) by solution blow spinning.

Abstract: A cable harness includes a support frame configured to support a plurality of cables coupled to an electronic device. The cable harness also includes a tapered frame comprising a first end and a second end. The second end is smaller than the first end and the first end is coupled to the support frame. The cable harness further includes an attachment portion coupled to the tapered frame at the second end. The attachment portion is configured to attach the cable harness to the electronic device.