Patents by Inventor Prasad Venugopal

Prasad Venugopal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12005692
    Abstract: The invention provides a nonwoven laminate, comprising in order (A) to (E): a spunbond nonwoven layer (A) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; an optional spunbond nonwoven layer (B) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (B) having a higher copolyester content than nonwoven layer (A); a needled staple fibre nonwoven layer (C), comprising: monocomponent polyethylene terephthalate (PET) staple fibres (c1), and multicomponent staple fibres (c2), which comprise at least a polyethylene terephthalate (PET) component and a copolyester component; an optional spunbond nonwoven layer (D) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (D) having a higher copolyester content than nonwoven layer (E); a spunbond nonwoven layer (E) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; wherein all layers are melt-bonded to each ot
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: June 11, 2024
    Assignee: CARL FREUDENBERG KG
    Inventors: Arun Prasad Venugopal, Gerhard Schoepping
  • Patent number: 11976395
    Abstract: An embossed non-woven for the vehicle interior, includes: polyethylene terephthalate framework staple fibers; and polyethylene terephthalate binding staple fibers. A proportion of polyethylene terephthalate binding staple fibers is 5 to 50 wt. % based on a total weight of the non-woven. The polyethylene terephthalate binding staple fibers includes core/shell staple fibers. A shell of the core/shell staple fibers has low-melting co-polyethylene terephthalate having a melting point measured in accordance with DIN ISO 11357-3 (2013) in a range of 80° C. to 230° C.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: May 7, 2024
    Assignee: CARL FREUDENBERG KG
    Inventors: Arun Prasad Venugopal, Dasa Urbanc, Andreja Jurjevcic, Angela Weik
  • Patent number: 11737204
    Abstract: A network device having improved thermal cooling is provided. The network device includes a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: August 22, 2023
    Assignee: ARISTA NETWORKS, INC.
    Inventors: Pranav Devalla, Harold Wang, Prasad Venugopal, Aravind Musunuri
  • Patent number: 11639242
    Abstract: A packaging for sterile packaging application includes: a single layer nonwoven fabric obtained from a nonwoven, the nonwoven including meltblown polymer fibers having an average fiber diameter between 2 ?m to 10 ?m and a standard deviation of the fiber diameter of at least 100%. The nonwoven is thermally bonded.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: May 2, 2023
    Assignee: CARL FREUNDENBERG KG
    Inventors: Arun Prasad Venugopal, Nicolas Bernhard, Thomas Hofbauer, Klaus-Dietmar Wagner
  • Patent number: 11453202
    Abstract: A thermoformable decorative material for an automotive interior includes: a decorative layer including a textile substrate; a digitally printed design disposed on at least one side of the textile substrate and having dispersion ink and/or pigment ink; and an overlay adhesive coating applied to the digitally printed design. The overlay adhesive coating has an adhesive that includes polyurethane and/or polyacrylate.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: September 27, 2022
    Assignee: CARL FREUDENBERG KG
    Inventors: Johanna Spoerl, Feng Li, Arun Prasad Venugopal, Klaus-Dietmar Wagner, Angela Weik
  • Publication number: 20220258937
    Abstract: A packaging includes a composite material. The composite material includes a barrier layer and a backing layer. The backing layer includes a spunbonded nonwoven, arranged on at least one side of the barrier layer and bonded to the barrier layer by heat and pressure. The barrier layer includes a nonwoven containing 1 to 70 wt % melt-blown fibers and 30 to 99 wt % staple fibers, relative to a total weight of the nonwoven in each case.
    Type: Application
    Filed: February 3, 2022
    Publication date: August 18, 2022
    Inventors: Johanna Spoerl, Arun Prasad Venugopal, Klaus-Dietmar Wagner, Anthony Hollingsworth, Michaela Rau, Alexander Kolew, Naotaka Kimura
  • Publication number: 20220178058
    Abstract: An embossed non-woven for the vehicle interior, includes: polyethylene terephthalate framework staple fibers; and polyethylene terephthalate binding staple fibers. A proportion of polyethylene terephthalate binding staple fibers is 5 to 50 wt. % based on a total weight of the non-woven. The polyethylene terephthalate binding staple fibers includes core/shell staple fibers. A shell of the core/shell staple fibers has low-melting co-polyethylene terephthalate having a melting point measured in accordance with DIN ISO 11357-3 (2013) in a range of 80° C. to 230° C.
    Type: Application
    Filed: June 21, 2021
    Publication date: June 9, 2022
    Inventors: Arun Prasad Venugopal, Dasa Urbanc, Andreja Jurjevcic, Angela Weik
  • Publication number: 20220141949
    Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.
    Type: Application
    Filed: January 19, 2022
    Publication date: May 5, 2022
    Inventors: Pranav Devalla, Harold Wang, Prasad Venugopal, Aravind Musunuri
  • Patent number: 11266007
    Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: March 1, 2022
    Assignee: Arista Networks, Inc.
    Inventors: Pranav Devalla, Harold Wang, Prasad Venugopal, Aravind Musunuri
  • Patent number: 11216325
    Abstract: Embodiments of the present disclosure provide a method and apparatus for reducing cross talk among pins in a connector. The apparatus may detect a bit error rate (BER) for each of a plurality of pins in a connector and compare the BER for each pin to a threshold BER. Responsive to determining that a set of pins among the plurality of pins each have a BER that is above the threshold BER, the apparatus may decrease the BER for each pin in the set of pins by selecting a subset of pins among the plurality of pins and adjusting operational characteristics of one or more of the subset of pins. The operational characteristics include a transmit power of the pin.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 4, 2022
    Assignee: Arista Networks, Inc.
    Inventors: Ankush Dhar, Harold Wang, Prasad Venugopal, Arul Ramalingam
  • Publication number: 20210299998
    Abstract: A thermoformable decorative material for an automotive interior includes: a decorative layer including a textile substrate; a digitally printed design disposed on at least one side of the textile substrate and having dispersion ink and/or pigment ink; and an overlay adhesive coating applied to the digitally printed design. The overlay adhesive coating has an adhesive that includes polyurethane and/or polyacrylate.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Johanna Spoerl, Feng Li, Arun Prasad Venugopal, Klaus-Dietmar Wagner, Angela Weik
  • Patent number: 11071226
    Abstract: A cable harness includes a support frame configured to support a plurality of cables coupled to an electronic device. The cable harness also includes a tapered frame comprising a first end and a second end. The second end is smaller than the first end and the first end is coupled to the support frame. The cable harness further includes an attachment portion coupled to the tapered frame at the second end. The attachment portion is configured to attach the cable harness to the electronic device.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: July 20, 2021
    Assignee: Arista Networks, Inc.
    Inventors: Youngbae Park, Prasad Venugopal, Hong Wang
  • Publication number: 20210084749
    Abstract: A network device having improved thermal cooling is provided. The network device comprising a first printed circuit board (PCB) having a plurality of common connectors and one or more second PCBs, each second PCB coupled to the first PCB by a respective common connector of the plurality of common connectors. Each second PCB may include a set of ports, each port in the set of ports coupled to the respective common connector via the second PCB. The one or more second PCBs may be arranged vertically parallel on a front side of the first PCB such that each second PCB forms a 90 degree angle with the first PCB to allow air to flow in spaces defined between vertically adjacent second PCBs.
    Type: Application
    Filed: September 18, 2019
    Publication date: March 18, 2021
    Inventors: Pranav Devalla, Harold Wang, Prasad Venugopal, Aravind Musunuri
  • Publication number: 20210023815
    Abstract: The invention provides a nonwoven laminate, comprising in order (A) to (E): a spunbond nonwoven layer (A) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; an optional spunbond nonwoven layer (B) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (B) having a higher copolyester content than nonwoven layer (A); a needled staple fibre nonwoven layer (C), comprising: monocomponent polyethylene terephthalate (PET) staple fibres (c1), and multicomponent staple fibres (c2), which comprise at least a polyethylene terephthalate (PET) component and a copolyester component; an optional spunbond nonwoven layer (D) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester, the nonwoven layer (D) having a higher copolyester content than nonwoven layer (E); a spunbond nonwoven layer (E) comprising fibres, which comprise polyethylene terephthalate (PET) and copolyester; wherein all layers are melt-bonded to each ot
    Type: Application
    Filed: July 20, 2020
    Publication date: January 28, 2021
    Inventors: Arun Prasad Venugopal, Gerhard Schoepping
  • Publication number: 20200409439
    Abstract: Embodiments of the present disclosure provide a method and apparatus for reducing cross talk among pins in a connector. The apparatus may detect a bit error rate (BER) for each of a plurality of pins in a connector and compare the BER for each pin to a threshold BER. Responsive to determining that a set of pins among the plurality of pins each have a BER that is above the threshold BER, the apparatus may decrease the BER for each pin in the set of pins by selecting a subset of pins among the plurality of pins and adjusting operational characteristics of one or more of the subset of pins. The operational characteristics include a transmit power of the pin.
    Type: Application
    Filed: June 28, 2019
    Publication date: December 31, 2020
    Inventors: Ankush Dhar, Harold Wang, Prasad Venugopal, Arul Ramalingam
  • Publication number: 20200095706
    Abstract: The invention refers to the use of a parent solution (A) during a method for producing fibers for a fiber fleece by a so-called solution blow spinning. Water is used as solvent for the parent solution (A). At least one water-soluble polymer and preferably exactly one water-soluble polymer is dissolved in the water of the parent solution (A). The parent solution (A) additionally contains at least one surfactant and optionally plasticizer for the used at least one polymer respectively. By means of a parent solution (A) it is possible to produce fibers (24) by solution blow spinning.
    Type: Application
    Filed: December 15, 2017
    Publication date: March 26, 2020
    Inventors: Arun Prasad Venugopal, Andreas Tulke, Georgios Toskas
  • Publication number: 20200077531
    Abstract: A cable harness includes a support frame configured to support a plurality of cables coupled to an electronic device. The cable harness also includes a tapered frame comprising a first end and a second end. The second end is smaller than the first end and the first end is coupled to the support frame. The cable harness further includes an attachment portion coupled to the tapered frame at the second end. The attachment portion is configured to attach the cable harness to the electronic device.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 5, 2020
    Inventors: Youngbae Park, Prasad Venugopal, Hong Wang