Patents by Inventor Prasanna Karpur

Prasanna Karpur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatuses to stiffen integrated circuit package
    Patent number: 8502400
    Abstract: A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: August 6, 2013
    Assignee: Intel Corporation
    Inventors: Prasanna Karpur, Sriram Muthukumar
  • METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20120187583
    Abstract: A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
    Type: Application
    Filed: March 6, 2012
    Publication date: July 26, 2012
    Applicant: Intel Corporation
    Inventors: Prasanna Karpur, Sriram Muthukumar
  • Methods and apparatuses to stiffen integrated circuit package
    Patent number: 8143110
    Abstract: A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: March 27, 2012
    Assignee: Intel Corporation
    Inventors: Prasanna Karpur, Sriram Muthukumar
  • METHODS AND APPARATUSES TO STIFFEN INTEGRATED CIRCUIT PACKAGE
    Publication number: 20110147912
    Abstract: A dam stiffener for a package substrate is presented. In an embodiment, the dam stiffener comprises a thermally curable polymer, and is simultaneously cured with the underfill material to act as stiffener to the substrate. In another embodiment, a curable reservoir material can be dispensed to fill the space between the integrated circuit die and the dam stiffener, forming a thick reservoir layer, acting as an additional stiffener for the package substrate.
    Type: Application
    Filed: December 23, 2009
    Publication date: June 23, 2011
    Inventors: Prasanna Karpur, Sriram Muthukumar