Abstract: The disclosure describes a method for performing thermal reliability analysis of electronic devices such as multichip modules. The method supports the reliabilty of multichip technology during the design phase by integrating traditional thermal analysis techniques, such as Finite Element Analysis with artificial intelligence techniques. Specifically, the use of object oriented programming, blackboard architecture and knowledge sources (based on expert systems) allow the computer to perform lower level reasoning associated with the development of the finite element mesh. The use of software, called Intelligent Multichip Module Analyzer, results in a great reduction in the amount of time required to model and to perform thermal analysis of multichip modules. This allows the analysis to be integrated with the design process so that reliability assessment can be accomplished when it can best affect the final design.