Patents by Inventor PRASANNA PICHUMANI

PRASANNA PICHUMANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250132109
    Abstract: Apparatus including speakers ported through keys of a keyboard are disclosed. An example electronic device includes a housing, and a keyboard carried by the housing. The keyboard includes a key having a keycap that covers an associated switch. The example electronic device further includes a speaker within the housing underneath the keyboard. The keycap includes an opening to define a port through which sound from the speaker is able to pass.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 24, 2025
    Applicant: Intel Corporation
    Inventors: Shruthi Sudhakar, Sumod Cherukkate, Praveen Kashyap Ananta Bhat, Prakash Kurma Raju, Prasanna Pichumani, A Ezekiel Poulose
  • Patent number: 12284793
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 22, 2025
    Assignee: Intel Corporation
    Inventors: Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung Goh, Jeff Ku, Prakash Kurma Raju, Baomin Liu, Twan Sing Loo, Mikko Makinen, Columbia Mishra, Juha Paavola, Prasanna Pichumani, Daniel Ragland, Kannan Raja, Khal Ern See, Javed Shaikh, Gokul Subramaniam, George Baoci Sun, Xiyong Tian, Hua Yang, Mark Carbone, Vivek Paranjape, Nehakausar Pinjari, Hari Shanker Thakur, Christopher Moore, Gustavo Fricke, Justin Huttula, Gavin Sung, Sammi Wy Liu, Arnab Sen, Chun-Ting Liu, Jason Y. Jiang, Gerry Juan, Shih Wei Nien, Lance Lin, Evan Kuklinski
  • Publication number: 20250113443
    Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed to load an integrated circuit (IC) into a socket. An example apparatus to load an IC in a socket includes: a collar; a tightener; a ramp carried by at least one of the collar or the tightener; and a cam carried by at least another one of the collar or the tightener, the cam engageable with the ramp, rotation of the tightener to cause relative movement between the cam and the ramp to displace the collar to apply a load to the IC.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventors: Shyamjith Mohan, Raghavendra Rao, Rob Sims, Prasanna Pichumani, Vijith Halestoph R, Kylee Smith
  • Patent number: 12261318
    Abstract: Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 25, 2025
    Assignee: Intel Corporation
    Inventors: Prasanna Pichumani, Jagadish Vasudeva Singh, Prakash Kurma Raju, Vinay Kumar Chandrasekhara, Arvind Sundaram, Naoki Matsumura
  • Patent number: 12230866
    Abstract: Various embodiments utilize part of an existing antenna pattern in a computing device to implement a specific absorption rate (SAR) sensor element using a radio frequency (RF) filter circuit. The integrated solutions of the present disclosure help to eliminate the external SAR sensor pad requirement and further help to improve wireless performance. The embodiments of the present disclosure may be implemented with a variety of different types of antenna (e.g., slot, metal ring/aperture, PCB, etc.). Other embodiments may be described and claimed.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 18, 2025
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Maruti Tamrakar, Sagar Gupta, Prasanna Pichumani, Sudheera Sudhakar
  • Publication number: 20250046983
    Abstract: Disclosed herein is an encapsulated antenna for reducing the impact of radio frequency interference (RFI) that may couple to the antenna at frequencies within the Wi-FI 5/6e bandwidths. The encapsulated antenna device may include an insulating housing and a metal layer arranged within a cavity of the housing. The encapsulated antenna device also includes an antenna device comprising a ground terminal and an antenna body, wherein the ground terminal is connected to the metal layer, wherein the antenna body is arranged above the metal layer and within the cavity. The encapsulated antenna device also includes a spacer between the metal layer and the antenna body that provides an offset distance between the metal layer and the antenna body.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Inventors: Bala SUBRAMANYA, Prakash KURMA RAJU, Jayprakash THAKUR, Zaman Zaid MULLA, Praveen KUMAR, Yagnesh Vinodrai WAGHELA, Maruti TAMRAKAR, Prasanna PICHUMANI, Harry SKINNER
  • Publication number: 20240410396
    Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.
    Type: Application
    Filed: June 6, 2023
    Publication date: December 12, 2024
    Applicant: Intel Corparation
    Inventors: Arnab Sen, Srinivasarao Konakalla, Samarth Alva, Amit Kumar, Rachit Garg, Bhavaneeswaran Anbalagan, Raghavendra S. Kanivihalli, Prasanna Pichumani
  • Patent number: 12117876
    Abstract: An electronic device may comprise a first chassis, a second chassis, and a hinge assembly configured to rotatably couple the first and second chassis together. The hinge assembly may include a guide unit including a first guide member and a second guide member disposed on opposite sides of a hinge plane and spaced to define a passage area therebetween. The hinge assembly may further include a biasing member configured to move the guide unit such that the passage area of the guide unit traverses the hinge plane in a first direction as the first chassis rotates from a closed position to a fully rotated position. The electronic device may also include a heat carrying member having one end disposed in the first chassis, a second end disposed in the second chassis, and a middle portion extending through the passage area. The size of the passage area may remain fixed.
    Type: Grant
    Filed: November 21, 2020
    Date of Patent: October 15, 2024
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Samarth Alva, Bhavaneeswaran Anbalagan, Triplicane Gopikrishnan Babu, Prasanna Pichumani, Raghavendra Doddi, Sudheera Sudhakar, Ritu Bawa
  • Patent number: 12087995
    Abstract: Examples relate to concepts for antenna arrangement and particular to an antenna for an electronic device. An electronic device comprises, a case, a lid and a heat spreading structure. Further, an electronic device comprises a hinge arrangement between the case and the lid. The hinge arrangement comprises at least one hinge structure connecting the lid to the case. Further, the electronic device comprises an antenna. The antenna is arranged in an area of the hinge arrangement. The heat spreading structure extends from the case through the area of the hinge arrangement to the lid.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: September 10, 2024
    Assignee: Intel Corporation
    Inventors: Jayprakash Thakur, Prasanna Pichumani, Maruti Tamrakar, Doddi Raghavendra, Sagar Gupta
  • Publication number: 20240292557
    Abstract: A surface-mounted retaining assembly is provided for retaining an electronic component. The electronic component may comprise an internal expansion card of an electronic device, and may comprise an M.2 module. The retaining assembly utilizes a spring-loaded retaining mechanism and may be bonded to a printed circuit board (PCB) via a small footprint solder pad. The retaining assembly eliminates the need for through-hole or surface-mounted standoffs, and thus increases the usable routing area on all layers. Additionally, the retaining assembly does not require a threaded component, and is suitable for low profile applications for which threaded components are infeasible.
    Type: Application
    Filed: April 30, 2024
    Publication date: August 29, 2024
    Inventors: Pharveen Parameswaran, Santhosh Ap, Poh Ling Lee, Prasanna Pichumani, Vijith Halestoph R, Syed Bukhari Syed Shafi, Anas Zakaria
  • Patent number: 12046819
    Abstract: A slot antenna assembly for a portable electronic device is disclosed. The assembly includes a first slot antenna having a first slot through a substrate from an outer surface of the substrate to an inner surface of the substrate. The assembly also includes a second slot antenna including a second slot through the substrate from the outer surface of the substrate to the inner surface of the substrate. An isolator includes at least one of an isolation slot and a conductor. The isolation slot includes a substrate isolation slot which extends through the substrate between the first and second slot antennas; and a conductor. The conductor connects the inner surface of the substrate between the first and second antennas to an opposite inner surface of an opposite substrate opposite the inner surface between the first and second antennas.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: July 23, 2024
    Assignee: Intel Corporation
    Inventors: Maruti Tamrakar, Sagar Gupta, Jayprakash Thakur, Prasanna Pichumani
  • Publication number: 20240155790
    Abstract: Techniques are described to address issues for repairing and/or servicing electronic components through the use of retaining assemblies that use bimetal retaining mechanisms. The bimetal retaining mechanisms may comprise various shapes such as hooks, snap-hooks, clips, etc., and facilitate a temperature-selective removal of various electronic components such as displays, EMI shields, etc. without damaging these components and without compromising the thickness and weight of the electronic device. External heating systems may be used to trigger actuation of the bimetal retaining mechanisms, resulting in their release. Alternatively, internal electronic device heating systems may be used.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 9, 2024
    Inventors: Deepak Sekar, Samarth Alva, Prakash Kurma Raju, Prasanna Pichumani, Arnab Sen
  • Publication number: 20240055779
    Abstract: A circuitry including a first antenna configured to communicate via a first RAT; including a substrate; and a second antenna located on the substrate of the first antenna configured to communicate via a second RAT, wherein communication via the first RAT does not interfere with communication via the second RAT.
    Type: Application
    Filed: July 6, 2023
    Publication date: February 15, 2024
    Inventors: Maruti TAMRAKAR, Prathibha PEDDIREDDY, Jayprakash THAKUR, Anoop PARCHURU, Prasanna PICHUMANI
  • Patent number: 11903161
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a fan where the fan blades are decoupled from the center shaft. The fan can include a center shaft, a motor coil support, motor coils coupled to the motor coil support, a rotator coupled to the center shaft, and fan blades coupled to the rotator, where rotation of the fan blades is decoupled from the center shaft by the rotator. A blade support can be coupled to the rotator, where the blade support couples the fan blades to the rotator and magnets can be coupled to the blade support. In an example, the rotator can include an inner, an outer race, and bearings.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: February 13, 2024
    Assignee: Intel Corporation
    Inventors: Srinivas Rao Konakalla, Prakash Kurma Raju, Bijendra Singh, Juha Tapani Paavola, Prasanna Pichumani
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Patent number: 11755080
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Publication number: 20230198122
    Abstract: A communication device including a chassis; and a wireless communication interface arranged at least in part on a mounting structure, wherein the chassis houses the wireless communication interface, wherein the wireless communication interface comprises an antenna; and wherein the chassis comprises a recess, and wherein the mounting structure is rotatably arranged in the recess.
    Type: Application
    Filed: December 21, 2021
    Publication date: June 22, 2023
    Inventors: Maruti TAMRAKAR, Prasanna PICHUMANI, Jayprakash THAKUR, Sagar GUPTA
  • Publication number: 20230024409
    Abstract: A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 6, 2022
    Publication date: January 26, 2023
    Inventors: Smit KAPILA, Prakash Kurma RAJU, Abhishek SRIVASTAV, Prasanna PICHUMANI, Raghavendra Subramanya Setty KANIVIHALLI
  • Patent number: 11551891
    Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Raghavendra Doddi, Prasanna Pichumani, Sachin Bedare, Bijendra Singh, Gopinath Kandasamy
  • Publication number: 20220413547
    Abstract: A cover for a tablet or similar computer device equipped with strap hinges is disclosed. In embodiments, the cover may include three strap hinges to allow the tablet to be placed in several different configurations. The cover is equipped with at least two magnets in different polarities, which may be detected by the tablet. Based on the detection of at least one magnet and its polarity, the tablet may cause the interface of its operating system to be placed into a configuration appropriate to the configuration of the cover. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 8, 2022
    Publication date: December 29, 2022
    Inventors: Gavin Sung, Mallari C. Hanchate, Prasanna Pichumani, Prakash Kurma Raju, Tim Liu