Patents by Inventor Prashant A. Aji
Prashant A. Aji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230305531Abstract: A cool cluster comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device of the tool cluster. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: ApplicationFiled: May 30, 2023Publication date: September 28, 2023Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Patent number: 11709477Abstract: A substrate processing system comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device connected to each of the plurality of process chambers. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: GrantFiled: January 6, 2021Date of Patent: July 25, 2023Assignee: Applied Materials, Inc.Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Publication number: 20220214662Abstract: A substrate processing system comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device connected to each of the plurality of process chambers. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine learning model; after maintenance has been performed on the first process chamber, receive second measurements generated by the sensors during or after a seasoning process is performed within the first process chamber; and determine that the first process chamber is ready to be brought back into service based on processing the second measurements using a second trained machine learning model.Type: ApplicationFiled: January 6, 2021Publication date: July 7, 2022Inventors: Priyadarshi Panda, Lei Lian, Pengyu Han, Todd J. Egan, Prashant Aji, Eli Mor, Alex J. Tom, Leonard Michael Tedeschi
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Patent number: 9747520Abstract: Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.Type: GrantFiled: March 11, 2016Date of Patent: August 29, 2017Assignee: KLA-Tencor CorporationInventors: Shifang Li, Youxian Wen, Sven Schwitalla, Prashant Aji, Lena Nicolaides
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Publication number: 20170161418Abstract: Various embodiments for using three-dimensional representations for defect-related applications are provided. One computer-implemented method for determining one or more inspection parameters for a wafer inspection recipe includes generating a three-dimensional representation of one or more layers of a wafer based on design data. The method also includes determining one or more inspection parameters for a wafer inspection recipe based on the three-dimensional representation.Type: ApplicationFiled: February 20, 2017Publication date: June 8, 2017Inventors: Allen Park, Ellis Chang, Prashant A. Aji, Steven R. Lange
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Patent number: 9645097Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.Type: GrantFiled: June 17, 2015Date of Patent: May 9, 2017Assignee: KLA-Tencor CorporationInventors: Lena Nicolaides, Ben-ming Benjamin Tsai, Prashant A. Aji, Michael Gasvoda, Stanley E. Stokowski, Guoheng Zhao, Youxian Wen, Mohan Mahadevan, Paul D. Horn, Wolfgang Vollrath, Isabella T. Lewis
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Publication number: 20160275671Abstract: Systems and methods for enhancing inspection sensitivity to detect defects in wafers using an inspection tool are disclosed. A plurality of light emitting diodes illuminate at least a portion of a wafer and capture a set of grayscale images. A residual signal is determined in each image of the grayscale image set and the residual signal is subtracted from each image of the grayscale image set. Defects are identified based on the subtracted grayscale image set. Models of the inspection tool and wafer may be built and refined in some embodiments of the disclosed systems and methods.Type: ApplicationFiled: March 11, 2016Publication date: September 22, 2016Inventors: Shifang Li, Youxian Wen, Sven Schwitalla, Prashant Aji, Lena Nicolaides
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Publication number: 20150370175Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.Type: ApplicationFiled: June 17, 2015Publication date: December 24, 2015Applicant: KLA-Tencor CorporationInventors: Lena Nicolaides, Ben-ming Benjamin Tsai, Prashant A. Aji, Michael Gasvoda, Stanley E. Stokowski, Guoheng Zhao, Youxian Wen, Mohan Mahadevan, Paul D. Horn, Wolfgang Vollrath, Isabella T. Lewis
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Publication number: 20140291516Abstract: Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.Type: ApplicationFiled: June 11, 2014Publication date: October 2, 2014Inventors: Mehran Nasser-Ghodsi, Mark Borowicz, Dave Bakker, Mehdi Vaez-Iravani, Prashant Aji, Rudy Garcia, Tzu Chin Chuang
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Patent number: 8765496Abstract: Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.Type: GrantFiled: April 28, 2008Date of Patent: July 1, 2014Assignee: KLA-Tencor Technologies Corp.Inventors: Mehran Nasser-Ghodsi, Mark Borowicz, Dave Bakker, Mehdi Vaez-Iravani, Prashant Aji, Rudy Garcia, Tzu Chin Chuang
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Patent number: 8705027Abstract: A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer.Type: GrantFiled: July 15, 2010Date of Patent: April 22, 2014Assignee: KLA-Tencor CorporationInventors: Steven R. Lange, Stephane Durant, Gregory L. Kirk, Robert M. Danen, Prashant Aji
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Publication number: 20120316855Abstract: Various embodiments for using three-dimensional representations for defect-related applications are provided.Type: ApplicationFiled: June 8, 2011Publication date: December 13, 2012Applicant: KLA-TENCOR CORPORATIONInventors: Allen Park, Ellis Chang, Prashant A. Aji, Steven R. Lange
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Publication number: 20120113416Abstract: A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer.Type: ApplicationFiled: July 15, 2010Publication date: May 10, 2012Applicant: KLA-TENCOR CORPORATIONInventors: Steven R. Lange, Stephane Durant, Gregory L. Kirk, Robert M. Danen, Prashant Aji
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Publication number: 20080264905Abstract: Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.Type: ApplicationFiled: April 28, 2008Publication date: October 30, 2008Inventors: Mehran Nasser-Ghodsi, Mark Borowicz, Dave Bakker, Mehdi Vaez-Iravani, Prashant Aji, Rudy F. Garcia, Tzu Chin Chuang
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Patent number: 7283659Abstract: Disclosed are methods and apparatus for automatically organizing and/or analyzing a plurality of defect images without first providing a predefined set of classified images (herein referred to as a training set). In other words, sorting is not based on a training set or predefined classification codes for such defect images. In one embodiment, the defect images each include associated identifying data, such as a fabrication identifier, lot number, wafer number, and layer identifier. Initially, the defect images are sorted according to at least a portion of the associated identifying data into a plurality of “identifying data groups” or image families. The defect data in each identifying data group is then automatically sorted according to defect appearance. That is, similar defect images are associated with a single bin and similar bins are associated with other similar bins. For example, similar bins are arranged next to each other within a graphical user interface (GUI).Type: GrantFiled: June 18, 2002Date of Patent: October 16, 2007Assignee: KLA-Tencor Technologies CorporationInventors: David R. Bakker, Prashant A. Aji, James L. Belliveau, Chacko C. Neroth
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Patent number: 7072786Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.Type: GrantFiled: September 28, 2005Date of Patent: July 4, 2006Assignee: KLA-Tencor Technologies, CorporationInventors: David Bruce Coldren, Prashant A. Aji, David Winslow Randall, Sharon Marie McCauley
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Publication number: 20060025948Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.Type: ApplicationFiled: September 28, 2005Publication date: February 2, 2006Applicant: KLA-Tencor Technologies CorporationInventors: David Coldren, Prashant Aji, David Randall, Sharon McCauley
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Patent number: 6959251Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.Type: GrantFiled: November 14, 2002Date of Patent: October 25, 2005Assignee: KLA-Tencor Technologies, CorporationInventors: David Bruce Coldren, Prashant A. Aji, David Winslow Randall, Sharon Marie McCauley
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Publication number: 20050221229Abstract: Methods and systems for measuring a characteristic of a substrate or preparing a substrate for analysis are provided. One method for measuring a characteristic of a substrate includes removing a portion of a feature on the substrate using an electron beam to expose a cross-sectional profile of a remaining portion of the feature. The feature may be a photoresist feature. The method also includes measuring a characteristic of the cross-sectional profile. A method for preparing a substrate for analysis includes removing a portion of a material on the substrate proximate to a defect using chemical etching in combination with an electron beam. The defect may be a subsurface defect or a partially subsurface defect. Another method for preparing a substrate for analysis includes removing a portion of a material on a substrate proximate to a defect using chemical etching in combination with an electron beam and a light beam.Type: ApplicationFiled: March 22, 2005Publication date: October 6, 2005Inventors: Mehran Nasser-Ghodsi, Mark Borowicz, Dave Bakker, Mehdi Vaez-Iravani, Prashant Aji, Rudy Garcia, Tzu Chuang
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Publication number: 20040038454Abstract: Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.Type: ApplicationFiled: November 14, 2002Publication date: February 26, 2004Applicant: KLA-Tencor Technologies CorporationInventors: David Bruce Coldren, Prashant A. Aji, David Winslow Randall, Sharon Marie McCauley