Patents by Inventor Prashant Dinkar Karandikar
Prashant Dinkar Karandikar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240095962Abstract: This disclosure provides systems, methods, and devices for image signal processing that support compression of image data from image sensors with different color filter array (CFA) configurations. In a first aspect, a method of image processing includes receiving, by a processor, first image data from a first image sensor having a first color filter configuration, the first image data comprising a plurality of values organized according to the first color filter; determining, by the processor, second image data by re-arranging the plurality of values of the first image data; determining, by the processor, third image data by compressing the second image data; and storing, by the processor, the third image data into memory. Other aspects and features are also claimed and described.Type: ApplicationFiled: September 21, 2022Publication date: March 21, 2024Inventors: Prashant Dinkar Karandikar, Animesh Behera, Swapnil Dattatray Raykar, Amrit Anand Amresh, Pooja Bangalore Sridhara, Saurabh Ramesh Gangurde
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Publication number: 20230360166Abstract: In a computing device having a pipeline of image processing components, DCVS bandwidth voting may be based on a feedforward compression ratio determined by the first image processing component in the pipeline. The DCVS bandwidth voting may be based on the result of a comparison of change in the feedforward compression ratio with a threshold. Transaction initiator components in the pipeline may select their votes for bandwidth from among a feedforward compression ratio-based value and one or more other values, based on the result of the comparison with the threshold. DCVS parameters may be selected based on bandwidth votes received from transaction initiator components.Type: ApplicationFiled: May 3, 2022Publication date: November 9, 2023Inventors: PRASHANT DINKAR KARANDIKAR, Pradeep VENKATASUBBARAO, Manmohan MANOHARAN, Vivekanandan NAVEEN, Nagashree UPADHYA, Shubham SANGAL, Srinivas TURAGA, Shreya Pandurang MATHH
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Publication number: 20230258454Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: ApplicationFiled: April 25, 2023Publication date: August 17, 2023Inventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
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Patent number: 11662211Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: GrantFiled: August 3, 2020Date of Patent: May 30, 2023Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
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Patent number: 11636625Abstract: Embodiments include methods for image compression and decompression. A sending computing device may determine a type of packing used for a chunk of image data, generate metadata describing the type of packing used for the chunk of image data, pack the chunk of image data according to the determined type of packing, and send the packed chunk of image data and the metadata to a second computing device. A receiving computing device may decode the metadata describing the type of packing used for the chunk of image data, determine the type of packing used for the chunk of image data based on the decoded metadata, and unpack the chunk of image data according to the determined type of packing used for the chunk of image data.Type: GrantFiled: December 11, 2020Date of Patent: April 25, 2023Assignee: QUALCOMM IncorporatedInventors: Andrew Edmund Turner, Prashant Dinkar Karandikar
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Publication number: 20220189068Abstract: Embodiments include methods for image compression and decompression. A sending computing device may determine a type of packing used for a chunk of image data, generate metadata describing the type of packing used for the chunk of image data, pack the chunk of image data according to the determined type of packing, and send the packed chunk of image data and the metadata to a second computing device. A receiving computing device may decode the metadata describing the type of packing used for the chunk of image data, determine the type of packing used for the chunk of image data based on the decoded metadata, and unpack the chunk of image data according to the determined type of packing used for the chunk of image data.Type: ApplicationFiled: December 11, 2020Publication date: June 16, 2022Inventors: Andrew Edmund TURNER, Prashant Dinkar KARANDIKAR
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Publication number: 20200363210Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: ApplicationFiled: August 3, 2020Publication date: November 19, 2020Inventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
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Patent number: 10767998Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: GrantFiled: August 28, 2018Date of Patent: September 8, 2020Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
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Publication number: 20180364051Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: ApplicationFiled: August 28, 2018Publication date: December 20, 2018Inventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Moody
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Patent number: 10089172Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: GrantFiled: December 31, 2014Date of Patent: October 2, 2018Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Mody
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Patent number: 9628787Abstract: A method for testing an imaging subsystem of a system-on-a-chip (SOC) is provided that includes executing imaging subsystem test software instructions periodically on a processor of the SOC, receiving reference image data in the imaging subsystem responsive to the executing of the test software instructions, performing image signal processing on the reference image data by the imaging subsystem to generate processed reference image data, and using the processed reference image data by the test software instructions to verify whether or not the imaging subsystem is operating correctly.Type: GrantFiled: January 27, 2015Date of Patent: April 18, 2017Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Rahul Gulati, Vasant Easwaran, Mihir Narendra Mody, Prashant Dinkar Karandikar, Prithvi Y. A. Shankar, Aishwarya Dubey, Kedar Chitnis, Rajat Sagar
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Patent number: 9430393Abstract: A system includes first and second processing components, a qualified based splitter component, a first and second configurable cache element and an arbiter component. The first data processing component generates a first request for a first portion of data at a first location within a memory. The second data processing component generates a second request for a second portion of data at a second location within the memory. The qualifier based splitter component routes the first request and the second request based on a qualifier. The first configurable cache element enables or disables prefetching data within a first region of the memory. The second configurable cache element enables or disables prefetching data within a second region of the memory. The arbiter component routes the first request and the second request to the memory.Type: GrantFiled: December 24, 2014Date of Patent: August 30, 2016Assignee: TEXAS INSTRUMENTS INCORPORATEDInventors: Prashant Dinkar Karandikar, Mihir Mody, Hetul Sanghavi, Vasant Easwaran, Prithvi Y. A. Shankar, Rahul Gulati, Niraj Nandan, Subrangshu Das
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Publication number: 20150339234Abstract: A system includes first and second processing components, a qualified based splitter component, a first and second configurable cache element and an arbiter component. The first data processing component generates a first request for a first portion of data at a first location within a memory. The second data processing component generates a second request for a second portion of data at a second location within the memory. The qualifier based splitter component routes the first request and the second request based on a qualifier. The first configurable cache element enables or disables prefetching data within a first region of the memory. The second configurable cache element enables or disables prefetching data within a second region of the memory. The arbiter component routes the first request and the second request to the memory.Type: ApplicationFiled: December 24, 2014Publication date: November 26, 2015Inventors: Prashant Dinkar Karandikar, Mihir Mody, Hetul Sanghavi, Vasant Easwaran, Prithvi Y.A. Shankar, Rahul Gulati, Niraj Nandan, Subrangshu Das
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Publication number: 20150304648Abstract: A method for testing an imaging subsystem of a system-on-a-chip (SOC) is provided that includes executing imaging subsystem test software instructions periodically on a processor of the SOC, receiving reference image data in the imaging subsystem responsive to the executing of the test software instructions, performing image signal processing on the reference image data by the imaging subsystem to generate processed reference image data, and using the processed reference image data by the test software instructions to verify whether or not the imaging subsystem is operating correctly.Type: ApplicationFiled: January 27, 2015Publication date: October 22, 2015Inventors: Rahul Gulati, Vasant Easwaran, Mihir Narendra Mody, Prashant Dinkar Karandikar, Prithvi Y.A. Shankar, Aishwarya Dubey, Kedar Chitnis, Rajat Sagar
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Publication number: 20150227421Abstract: Information communication circuitry, including a first integrated circuit for coupling to a second integrated circuit in a package on package configuration. The first integrated circuit comprises processing circuitry for communicating information bits, and the information bits comprise data bits and error correction bits, where the error correction bits are for indicating whether data bits are received correctly. The second integrated circuit comprises a memory for receiving and storing at least some of the information bits. The information communication circuitry also includes interfacing circuitry for selectively communicating, along a number of conductors, between the package on package configuration. In a first instance, the interfacing circuitry selectively communicates only data bits along the number of conductors.Type: ApplicationFiled: December 31, 2014Publication date: August 13, 2015Inventors: Rahul Gulati, Aishwarya Dubey, Nainala Vyagrheswarudu, Vasant Easwaran, Prashant Dinkar Karandikar, Mihir Moody