Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a rotatable mechanical input mechanism. In some examples, the electronic device comprises sense electrode positioned proximate to the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising drive circuitry operatively coupled to the mechanical input mechanism and configured for driving a drive signal onto the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising sense circuitry operatively coupled to the sense electrode and configured to measure an amount of coupling between the rotatable mechanical input mechanism and the sense electrode. In some examples, the electronic device comprises a housing, wherein the sense electrode is included in a gasket for connecting a display to the housing.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a rotatable mechanical input mechanism. In some examples, the electronic device comprises sense electrode positioned proximate to the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising drive circuity operatively coupled to the mechanical input mechanism and configured for driving a drive signal onto the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising sense circuitry operatively coupled to the sense electrode and configured to measure an amount of coupling between the rotatable mechanical input mechanism and the sense electrode. In some examples, the electronic device comprises a housing, wherein the sense electrode is included in a gasket for connecting a display to the housing.

Abstract: A wearable device is disclosed. The wearable device can comprise a housing; a crown; a proximity sensor; and a processor. The crown can be configured to receive input from a user. The proximity sensor can be configured to generate a field of view encompassing a first area adjacent to the housing and further configured to generate an output signal corresponding to whether an object is present within the field of view. The processor can be configured to determine, based on the output signal, whether the input corresponds to an intentional input or an unintentional input.

Abstract: A wearable device is disclosed. The wearable device can comprise a housing; a crown; a proximity sensor; and a processor. The crown can be configured to receive input from a user. The proximity sensor can be configured to generate a field of view encompassing a first area adjacent to the housing and further configured to generate an output signal corresponding to whether an object is present within the field of view. The processor can be configured to determine, based on the output signal, whether the input corresponds to an intentional input or an unintentional input.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a housing and an input mechanism cooperatively engaged with the housing and configured to rotate in a first direction about a rotation axis. In some examples, the electronic device comprises an input sensor configured to sense an input at the input mechanism based on rotation of the input mechanism. In some examples, the electronic device comprises an actuator coupled to the housing and configured to displace the input mechanism. In some examples, the electronic device comprises a force sensor coupled to the input mechanism and configured to sense an input at the input mechanism based on a force applied to the input mechanism along the second axis.

Abstract: In some examples, an optical encoder may consist of a light source that shines light onto a wheel which then reflects the light onto a sensor. Using information encoded in the reflected light, the rotation of the wheel may be determined. In some examples, rotation of the wheel may be determined by detecting an encoding pattern in light reflected from an exterior surface of the wheel. In some examples, the encoding pattern can be a pattern of light and dark stripes. In some examples, a pattern of light stripes can be generated from light reflecting off of reflective portions of the wheel. Some examples of the disclosure relate to using a surface topology for a wheel that can be used to generate an encoding pattern of light and dark stripes in light reflected from the surface of the wheel, even when the surface of the wheel is uniformly reflective.

Abstract: Examples of the disclosure enclose an optical target on an encoder and sensors inside a single integrated module, wherein the encoder and the sensors are coupled to the same rigid body to maintain optical alignment between the sensors and the optical target on the encoder. Further, the module itself may be hermetically sealed to protect the optical path (e.g., from a light source to the optical target to the sensors) from contamination due to outside dirt, debris, or light sources internal/external to the device that might further interfere with alignment and/or proper sensing. Because the integrated module results in smaller variations in the alignment between the optical target and the sensors, the dynamic range of the sensors may be reduced, resulting in less power consumption and, potentially, longer battery life for the device. The use of an integrated module can also enable relaxed manufacturing requirements for the optical sensor and/or the optical target.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a mechanical input configured to rotate in a first direction about a rotation axis in response to a first input at the mechanical input. In some examples, the electronic device comprises a mechanical input sensor coupled to the mechanical input and configured to sense a rotation of the mechanical input about the rotation axis. In some examples, the electronic device comprises a mechanical input actuator coupled to the mechanical input and configured to rotate the mechanical input in a second direction about the rotation axis. In some examples, the mechanical input comprises a shared driving and sensing segment. In some examples, the mechanical input sensor is configured to sense the rotation of the mechanical input at the shared driving and sensing segment. In some examples, the mechanical input actuator is configured to generate magnetic fields for rotating the mechanical input at the shared driving and sensing segment.

Abstract: In some examples, an optical encoder may consist of a light source that shines light onto a wheel which then reflects the light onto a sensor. Using information encoded in the reflected light, the rotation of the wheel may be determined. In some examples, rotation of the wheel may be determined by detecting an encoding pattern in light reflected from an exterior surface of the wheel. In some examples, the encoding pattern can be a pattern of light and dark stripes. In some examples, a pattern of light stripes can be generated from light reflecting off of reflective portions of the wheel. Some examples of the disclosure relate to using a surface topology for a wheel that can be used to generate an encoding pattern of light and dark stripes in light reflected from the surface of the wheel, even when the surface of the wheel is uniformly reflective.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a housing and an input mechanism cooperatively engaged with the housing and configured to rotate in a first direction about a rotation axis. In some examples, the electronic device comprises an input sensor configured to sense an input at the input mechanism based on rotation of the input mechanism. In some examples, the electronic device comprises an actuator coupled to the housing and configured to displace the input mechanism. In some examples, the electronic device comprises a force sensor coupled to the input mechanism and configured to sense an input at the input mechanism based on a force applied to the input mechanism along the second axis.

Abstract: An electronic device is disclosed. In some examples, the electronic device comprises a rotatable mechanical input mechanism. In some examples, the electronic device comprises sense electrode positioned proximate to the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising drive circuity operatively coupled to the mechanical input mechanism and configured for driving a drive signal onto the mechanical input mechanism. In some examples, the electronic device comprises a capacitive sense circuit comprising sense circuitry operatively coupled to the sense electrode and configured to measure an amount of coupling between the rotatable mechanical input mechanism and the sense electrode. In some examples, the electronic device comprises a housing, wherein the sense electrode is included in a gasket for connecting a display to the housing.

Abstract: Examples of the disclosure enclose an optical target on an encoder and sensors inside a single integrated module, wherein the encoder and the sensors are coupled to the same rigid body to maintain optical alignment between the sensors and the optical target on the encoder. Further, the module itself may be hermetically sealed to protect the optical path (e.g., from a light source to the optical target to the sensors) from contamination due to outside dirt, debris, or light sources internal/external to the device that might further interfere with alignment and/or proper sensing. Because the integrated module results in smaller variations in the alignment between the optical target and the sensors, the dynamic range of the sensors may be reduced, resulting in less power consumption and, potentially, longer battery life for the device. The use of an integrated module can also enable relaxed manufacturing requirements for the optical sensor and/or the optical target.

Abstract: A light sensor is described that includes an IR interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are disposed proximate to the surface of the substrate. An IR interference filter is disposed over the photodetectors. The IR interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors.

Abstract: A light sensor is described that includes an IR interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are disposed proximate to the surface of the substrate. An IR interference filter is disposed over the photodetectors. The IR interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors.

Abstract: A light sensor is described that includes an IR cut interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are formed in the substrate proximate to the surface of the substrate. An IR cut interference filter is disposed over the photodetectors. The IR cut interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR cut interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photodetectors.

Abstract: An electronic device includes a protective layer above a proximity sensor having a radiation emitter and a radiation detector. A groove, which may be wedge shaped, is formed in the bottom surface of the protective layer. A radiation barrier, which may be reflective or absorptive material, is placed in the groove in the bottom surface of the protective layer. A light blocking coating may be applied to the bottom surface and the groove of the protective layer to prevent the passage of visible radiation and permit the passage of infrared radiation. A radiation shield may be positioned between the emitter and the detector directly below the radiation barrier. Alignment features may be formed on the mating surfaces of the radiation barrier and radiation shield to align the protective layer with respect to the radiation shield and proximity sensor.

Abstract: An electronic device includes a protective layer above a proximity sensor having a radiation emitter and a radiation detector. A groove, which may be wedge shaped, is formed in the bottom surface of the protective layer. A radiation barrier, which may be reflective or absorptive material, is placed in the groove in the bottom surface of the protective layer. A light blocking coating may be applied to the bottom surface and the groove of the protective layer to prevent the passage of visible radiation and permit the passage of infrared radiation. A radiation shield may be positioned between the emitter and the detector directly below the radiation barrier. Alignment features may be formed on the mating surfaces of the radiation barrier and radiation shield to align the protective layer with respect to the radiation shield and proximity sensor.

Abstract: The present invention provides systems, devices and methods for fabricating miniature low-power light sensors. With the present invention, a light sensitive component, such as a diode, is fabricated on the front side of a silicon wafer. Connectivity from the front side of the wafer to the back side of the wafer is provided by a through silicon via. Solder bumps are then placed on the back side of the wafer to provide coupling to a printed circuit board. The techniques described in the present invention may also be applied to other types of semiconductor devices, such as light-emitting diodes, image sensors, pressure sensors, and flow sensors.

Abstract: A light sensor is described that includes an IR cut interference filter and at least one color interference filter integrated on-chip. The light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. Photodetectors are formed in the substrate proximate to the surface of the substrate. An IR cut interference filter is disposed over the photodetectors. The IR cut interference filter is configured to filter infrared light from light received by the light sensor to at least substantially block infrared light from reaching the photodetectors. At least one color interference filter is disposed proximate to the IR cut interference filter. The color interference filter is configured to filter visible light received by the light sensor to pass light in a limited spectrum of wavelengths (e.g., light having wavelengths between a first wavelength and a second wavelength) to at least one of the photo detectors.

Abstract: The present invention provides systems, devices and methods for fabricating miniature low-power light sensors. With the present invention, a light sensitive component, such as a diode, is fabricated on the front side of a silicon wafer. Connectivity from the front side of the wafer to the back side of the wafer is provided by a through silicon via. Solder bumps are then placed on the back side of the wafer to provide coupling to a printed circuit board. The techniques described in the present invention may also be applied to other types of semiconductor devices, such as light-emitting diodes, image sensors, pressure sensors, and flow sensors.