Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Abstract: A metallurgical process expands the grain structure in a heat sink from a fine grain to a coarse grain to improve the thermal conductivity of the heat sink. The temperature of the heat sink is raised to a level high enough to lead to a secondary re-crystallization grain growth in the metal alloy. The temperature of the heat sink is then gradually lowered to a cryogenic temperature and then immediately brought back up to ambient temperature to strengthen the material.

Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Abstract: A circuit board includes two planes. A via spans the planes, and an impedance component is placed in the via. The impedance component is coupled to both of the planes. The impedance component provides an impedance between the planes without the use of traces or hand soldering of components.

Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Abstract: A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate.

Abstract: Photon emissions from a backside of a silicon device or integrated circuit are detected. The photon emissions can be used for a technique to read output information from the silicon device, as the photon emissions from part of an output signal path for the silicon device. The emitted photons pass through openings of a mask positioned over the backside of the silicon device, and are detected by a photodetector array. Electrical signals are generated from the detected photons, and can be converted to optical signals for subsequent transmission from optical transmitters coupled to the photodetector.

Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Abstract: An electrical energy-generating heat sink system is described herein that provides a convenient and economical method for continuously recharging an energy storage device in electronic devices.

Abstract: A wireless peripheral for a processor-based device may include a plurality of operators or control buttons that are operated to indicate commands. Those commands may be forwarded over a wireless link in the form of electrical signals to the processor-based device. Operation of the controls or operators may be converted into electrical energy which may be utilized to power the wireless peripheral.

Abstract: A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate.

Abstract: A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.

Abstract: A portable hand-held device having a main display is provided with an auxiliary display that effectively doubles the useful viewing area. An auxiliary display video memory is allocated in memory and managed by a microprocessor within the device. The auxiliary display is either pivotally or slidingly mounted to a body portion of the device, preferably adjacent an outside edge of the main display to provide concurrent dual-display viewing and optional contiguity of displayed subject matter. A video memory management mechanism for managing the dual-display video memory in memory and for enabling pixel data to one or both of the displays may be hardware assisted, as by use of a high-speed video replay and/or rendering hardware mechanism. When not deployed for viewing, the auxiliary display folds or slides within the general confines of the body of the hand-held portable device, which may be a personal digital assistant (PDA), pocket personal computer (PC) or personal digital assistant (PDA).

Abstract: A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.

Abstract: Piezoelectric wafers are affixed to a circuit card to control displacement of the circuit card when vibrated. A trigger wafer located at an anti-node of the dominant mode shape produces a voltage as a function of modal displacement. A control system responsive to the trigger wafer produces voltages that are applied to flex wafers at a different anti-node of the dominant mode shape. The flex wafers expand and contract in a manner that reduces the modal displacement of the circuit card. Multiple flex wafers can exist, affixed to the circuit card substantially opposite each other, or a single flex wafer can exist with a single trigger wafer. The trigger wafer can be located substantially opposite the flex wafer or can be located elsewhere on the circuit card.

Abstract: Photon emissions from a backside of a silicon device or integrated circuit are detected. The photon emissions can be used for a technique to read output information from the silicon device, as the photon emissions from part of an output signal path for the silicon device. The emitted photons pass through openings of a mask positioned over the backside of the silicon device, and are detected by a photodetector array. Electrical signals are generated from the detected photons, and can be converted to optical signals for subsequent transmission from optical transmitters coupled to the photodetector.

Abstract: Piezoelectric material is embedded in epoxy layers of circuit cards to control thermal expansion and contraction as a function of temperature changes. A temperature sensor and thermostat generates a controlled voltage as a function of temperature and applies the voltage to piezoelectric blocks within the circuit card. Local areas of the circuit card can have different amounts of piezoelectric material or different thermostats. Piezoelectric blocks can be arranged in regular patterns or can be randomly or pseudo-randomly placed.