Abstract: A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.

Abstract: An enhanced joint thickness lead used for surface mounting electronic devices to a substrate, wherein a portion of the enhanced joint thickness lead that is substantially parallel to the substance. The enhanced joint thickness lead includes an arcuate structure, which provides an enhanced joint thickness for the solder used to connect the lead to the substrate. The enhanced joint thickness of the solder results in a more robust attachment of the electronic device.

Abstract: An iodine-containing thermal interface material disposed between a heat source and a heat dissipation device.

Abstract: A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.

Abstract: A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.

Abstract: A semiconductor substrate with integrated circuit devices on its front side and a high thermal conductivity layer such as diamond on its back side, with components such as capacitors embedded in the high thermal conductivity layer and coupled to the front side integrated circuits with vias through the substrate.

Abstract: A heat dissipation device including a base portion having a plurality of projections extending therefrom. The base portion may have a vapor chamber defined therein and may have first surface sloped from a central apex portion to edges of the base portion. The vapor chamber includes at least one extension on a vapor chamber upper surface which is adapted to direct a condensed working fluid toward a desired location on a vapor chamber lower surface. The vapor chamber lower surface may have at least one depression to collect a greater portion of the working fluid in a desired location(s).

Abstract: An iodine-containing thermal interface material disposed between a heat source and a heat dissipation device.

Abstract: A heat dissipation device comprising a base portion, having a chamber defined therein, and a plurality of projections extending from the base portion. At least one projection of the plurality of projections also has a chamber defined therein that is in fluid communication with the base portion chamber to form a vapor chamber of a heat pipe.

Abstract: A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.

Abstract: A heat dissipation device including a base portion having a plurality of projections extending radially therefrom. A cooling fluid and circulation tubes are used to increase the efficiency of the heat dissipation device by pumping the heat (via the cooling fluid) from the hot base portion to the tips of the projections. The cooling fluid is circulated by a small centrifugal pump, which is driven by a fan attached to the heat dissipation device used for creating forced air-cooling.