Abstract: A liquid cooled semiconductor device is provided. The device includes a semiconductor die, a heat spreader, a wetting material, a sealant, a substrate, and a base. The spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. The wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material. The substrate is mounted to the base, whereby the second side of the spreader is exposed to allow fluid to flow across the second side, directed within a channel defined by the base, and transfer heat away from the spreader.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: An electric machine for converting electrical energy to mechanical energy is disclosed. The electric machine includes a stator having an outer layer, a first intermediate layer, a second intermediate layer, and an inner layer. The electric machine further includes a rotor axially aligned and positioned within the stator. The rotor has at least one permanent magnet, and at least one busbar. The busbar is attached to the first intermediate layer. The busbar includes at least one bare power die in electrical communication therewith.

Abstract: Central mounting of control electronics proximate to the engine is provided by attaching the electronics to an upper surface of the intake manifold to provide heat shielding and heat conduction for active components on the circuit card. The central location provides extremely short harnesses to important actuators located in cylinder heads of the engine thus reducing wiring clutter and cost.

Abstract: A printed wiring board having electronic circuit devices (13, 44) such as semiconductors including a heat sink forming a housing (32, 36) for the printed wiring board, one of the electronic devices (13) being mounted on one portion (12) of a heat spreader that is formed of a material having high thermal conductivity, another portion (10) of the heat spreader forming a thermal energy flow path to the heat sink, thereby lowering the junction temperature at the electronic device (13) and increasing the reliability of the wiring board.

Abstract: A printed wiring board adapted to mount electronic devices including one or more heat spreaders secured to the wiring board, the heat spreaders being formed of a material having high thermal conductivity, each heat spreader being adapted to support an electronic device which is bonded to the heat spreader, the portion of the heat spreader adjacent the electronic device having a metallic layer of low coefficient of thermal expansion that provides a localized area having a coefficient of thermal expansion that is approximately the same as that of the electronic device thereby tending to eliminate thermal stresses in the bond material used to attach the electronic device to the heat spreader, the relatively high thermally conductive material allowing thermal energy to be transferred effectively from the electronic device through the heat spreader to an adjacent heat sink.