Abstract: A headlamp assembly for a motor vehicle having a light source, a chamber that receives the light source and a cooling channel for removing heat from the chamber. A conductive wall and an insulating wall cooperate to define the chamber and the channel. The conductive wall has a substantially higher thermal conductivity than the insulating wall to promote the heat exchange between the chamber and the cooling channel and to reduce heat exchange between the cooling channel and the relatively hot engine compartment.

Abstract: A headlamp assembly for a motor vehicle including a lens and a housing that cooperate to define an inner chamber that is generally isolated from the atmosphere. A heat sink includes a fin portion that extends from the inner chamber so as to be exposed to ambient air. A light source is located within the inner chamber and is supported on a base portion of the heat sink. The heat sink conducts heat from the light source to air located exterior of the chamber.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A container defines an annular chamber that is partially filled with a liquid coolant. The container is capable of receiving a cooling conduit in which forced air or liquid flows. Heat generated by an electronic device is transferred to the liquid coolant within the container and causes the liquid coolant to boil. The vaporized coolant rises away from the electronic device carrying the latent heat of vaporization. The vaporized coolant condenses on and near surfaces within the container cooled by the cooling conduit and the heat is transferred to the air or liquid within the cooling conduit. The condensed coolant travels back toward the electronic device via gravity and/or a wick structure.