Patents by Inventor Praveen Kumar Radhakrishnan

Praveen Kumar Radhakrishnan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10682645
    Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: June 16, 2020
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS ASIA PACIFIC PTE LTD
    Inventors: Praveen Kumar Radhakrishnan, Dino Faralli
  • Publication number: 20180236447
    Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
    Type: Application
    Filed: April 23, 2018
    Publication date: August 23, 2018
    Inventors: Praveen Kumar Radhakrishnan, Dino Faralli
  • Patent number: 9976914
    Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: May 22, 2018
    Assignees: STMICROELECTRONICS S.R.L., STMICROELECTRONICS ASIA PACIFIC PTE LTD
    Inventors: Praveen Kumar Radhakrishnan, Dino Faralli
  • Publication number: 20140369386
    Abstract: A microfluidic-based sensor, comprising: a semiconductor body, having a first and a second side opposite to one another in a direction; a buried channel, extending within the semiconductor body; a structural layer, of dielectric or insulating material, formed over the first side of the semiconductor body at least partially suspended above the buried channel; and a first thermocouple element, including a first strip, of a first electrical conductive material, and a second strip, of a second electrical conductive material different from the first electrical conductive material, electrically coupled to the first strip. The first thermocouple element is buried in the structural layer and partially extends over the buried channel at a first location. A corresponding manufacturing method is disclosed.
    Type: Application
    Filed: June 18, 2014
    Publication date: December 18, 2014
    Inventors: Praveen Kumar Radhakrishnan, Dino Faralli
  • Publication number: 20120165635
    Abstract: Temperature variations in a patient's body can lead to inaccurate glucose readings. To compensate for changes in temperature, the temperature at a glucose sensing site can be sensed using a thermocouple. A compensated glucose level can be determined based on the temperature and the sensed glucose level. A glucose sensing device is described that includes a glucose sensor having a working electrode and a thermocouple having a junction positioned proximate the working electrode, with both the glucose and temperature sensors including the same metals.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 28, 2012
    Applicant: STMicroelectronics Asia Pacific Pte Ltd.
    Inventors: Praveen Kumar Radhakrishnan, Shian Yeu Kam