Patents by Inventor Praveen Matlapudi

Praveen Matlapudi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090261851
    Abstract: According to some example embodiments, an interconnect has a crown with contact tips, in which each of the contact tips is structured to physically contact a substantially spherical solder ball along a curved inner surface of the contact tip.
    Type: Application
    Filed: April 18, 2008
    Publication date: October 22, 2009
    Applicant: ANTARES ADVANCED TEST TECHNOLOGIES, INC.
    Inventors: Jiachun Zhou, Praveen Matlapudi