Patents by Inventor Praveen Medis
Praveen Medis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8378559Abstract: The disclosed system includes a two-phase cooling apparatus configured for cooling an array of LED dies.Type: GrantFiled: August 20, 2010Date of Patent: February 19, 2013Assignee: Progressive Cooling Solutions, Inc.Inventors: Ahmed Shuja, Tom Griffin, Praveen Medis, Phil Craine
-
Publication number: 20130010464Abstract: A high intensity lamp is described herein. The lamp comprises a LED array emitting a light and a two-phase cooling apparatus. The LED array includes a plurality of LEDs. The LEDs are arranged in close proximity so that a luminous emittance from a emitter area of the LED array is at least 1000 lumens per square centimeter. The two-phase cooling apparatus is thermally coupled to the LED array.Type: ApplicationFiled: March 14, 2012Publication date: January 10, 2013Applicant: BritePointe, Inc.Inventors: Ahmed Shuja, Tom Griffin, Ron Van Thiel, Phil Craine, Praveen Medis
-
Publication number: 20110043092Abstract: The disclosed system includes a two-phase cooling apparatus configured for cooling an array of LED dies.Type: ApplicationFiled: August 20, 2010Publication date: February 24, 2011Applicant: Progressive Cooling Solutions, Inc.Inventors: Ahmed Shuja, Tom Griffin, Praveen Medis, Phil Craine
-
Patent number: 7723845Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: GrantFiled: October 31, 2007Date of Patent: May 25, 2010Assignee: University of CincinnatiInventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Patent number: 7723760Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: GrantFiled: October 31, 2007Date of Patent: May 25, 2010Assignee: University of CincinnatiInventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Patent number: 7705342Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 W/cm2).Type: GrantFiled: September 8, 2006Date of Patent: April 27, 2010Assignee: University of CincinnatiInventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Patent number: 7692926Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: GrantFiled: October 31, 2007Date of Patent: April 6, 2010Assignee: Progressive Cooling Solutions, Inc.Inventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Publication number: 20080128898Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotropic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: ApplicationFiled: October 31, 2007Publication date: June 5, 2008Inventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Publication number: 20080115913Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60w/cm2).Type: ApplicationFiled: October 31, 2007Publication date: May 22, 2008Inventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Publication number: 20080115912Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: ApplicationFiled: October 31, 2007Publication date: May 22, 2008Inventors: H. Thurman HENDERSON, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Publication number: 20080110598Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60 w/cm2).Type: ApplicationFiled: October 31, 2007Publication date: May 15, 2008Inventors: H. Thurman Henderson, Ahmed Shuja, Srinivas Parimi, Frank M. Gerner, Praveen Medis
-
Publication number: 20070095507Abstract: The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass where necessary), particularly compatible with the cooling needs for electronic and computer chips and package cooling. The microloop heat pipes (?LHP™) utilize cutting edge microfabrication techniques. The device has no pump or moving parts, and is capable of moving heat at high power densities, using revolutionary coherent porous silicon (CPS) wicks. The CPS wicks minimize packaging thermal mismatch stress and improves strength-to-weight ratio. Also burst-through pressures can be controlled as the diameter of the coherent pores can be controlled on a sub-micron scale. The two phase planar operation provides extremely low specific thermal resistance (20-60W/cm2).Type: ApplicationFiled: September 8, 2006Publication date: May 3, 2007Applicant: University of CincinnatiInventors: H. Henderson, Ahmed Shuja, Srinivas Parimi, Frank Gerner, Praveen Medis
-
Patent number: D691749Type: GrantFiled: January 4, 2012Date of Patent: October 15, 2013Assignee: Britepointe, Inc.Inventors: Ahmed Shuja, Ron van Thiel, Tom Griffin, Praveen Medis, Phil Craine