Patents by Inventor Praveen Reddy NALLA

Praveen Reddy NALLA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Through silicon via metallization
    Patent number: 9029258
    Abstract: To achieve the foregoing and in accordance with the purpose of the present invention, a method for filling through silicon vias is provided. A dielectric layer is formed over the through silicon vias. A barrier layer, comprising tungsten, is deposited by CVD or ALD over the dielectric layer. The through silicon vias are filled with a conductive material.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: May 12, 2015
    Assignee: Lam Research Corporation
    Inventors: Praveen Reddy Nalla, Novy Sastrawati Tjokro, Artur Kolics, Seshasayee Varadarajan
  • Electroless copper deposition
    Patent number: 8946087
    Abstract: A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: February 3, 2015
    Assignee: Lam Research Corporation
    Inventor: Praveen Reddy Nalla
  • THROUGH SILICON VIA METALLIZATION
    Publication number: 20140217590
    Abstract: To achieve the foregoing and in accordance with the purpose of the present invention, a method for filling through silicon vias is provided. A dielectric layer is formed over the through silicon vias. A barrier layer, comprising tungsten, is deposited by CVD or ALD over the dielectric layer. The through silicon vias are filled with a conductive material.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 7, 2014
    Applicant: Lam Research Corporation
    Inventors: Praveen Reddy NALLA, Novy Sastrawati TJOKRO, Artur KOLICS, Seshasayee VARADARAJAN
  • ELECTROLESS COPPER DEPOSITION
    Publication number: 20130203249
    Abstract: A method for providing metal filled features in a layer is provided. A metal seed layer is deposited on tops and bottoms of the features. Metal seed layer on tops of the features and overhangs is removed without removing metal seed layer on bottoms of features. An electroless deposition of metal is provided to fill the features, wherein the electroless deposition first deposits on the metal seed layer on bottoms of the features.
    Type: Application
    Filed: February 2, 2012
    Publication date: August 8, 2013
    Applicant: LAM RESEARCH CORPORATION
    Inventor: Praveen Reddy NALLA