Abstract: Embodiments provide a method and computer program product including program instructions executable by a baseboard management controller in a multi-processor system to perform various operations. The operations include detecting a number of memory modules connected to each of a plurality of central processing units (CPUs) in the multi-processor system during boot, initiating operation of the multi-processor system as a single unified node in response to each of the CPUs being connected to an equal number of memory modules, and initiating partitioning of the multi-processor system into a first partitioned node and a second partitioned node in response to a first set of one or more of the CPUs each being connected to a first number of memory modules and a second set of one or more of the CPUs each being connected to a second number of memory modules that is different than the first number of memory modules.

Abstract: This disclosure relates to systems and methods for performing single input based multifactor authentication. Multifactor authentication refers to an authentication system with enhanced security which utilizes more than one authentication forms to validate identity of a user. Conventionally, the process of multifactor authentication is a serial process which involves inputting of authentication information multiple times. However, with conventional approaches, delay is introduced in execution of the multifactor authentication process. The method of the present disclosure addresses unresolved problems of multifactor authentication by enabling two or more factors to be assessed simultaneously making the authentication process faster without sacrificing the robustness of authentication process. Embodiments of the present disclosure analyzes spoken response of the user to a dynamically generated question for multifactor authentication.

Abstract: The present invention relates to compositions comprising salt of acyl glutamate as primary surfactant or primary anionic surfactant and specific structurant polymers.

Abstract: The present invention relates to compositions which comprise salt of acyl glutamate as primary surfactant or primary anionic surfactant and which compositions are clear, low pH isotropic composition.

Abstract: The invention described herein relates to novel genes and their encoded proteins, termed Mutants Associated with Resistance to STI-571 (e.g., T315I Bcr-Abl), and to diagnostic and therapeutic methods and compositions useful in the management of various cancers that express MARS. The invention further provides methods for identifying molecules that bind to and/or modulate the functional activity of MARS.

Abstract: The present invention relates to compositions comprising salt of acyl glutamate as primary surfactant or primary anionic surfactant and which further comprise specific preservative systems.

Abstract: An integrated device package that includes a die, a substrate, a fill and a conductive interconnect. The die includes a pillar, where the pillar has a first pillar width. The substrate (e.g., package substrate, interposer) includes a dielectric layer and a substrate interconnect (e.g., surface interconnect, embedded interconnect). The fill is located between the die and the substrate. The conductive interconnect is located within the fill. The conductive interconnect includes a first interconnect width that is about the same or less than the first pillar width. The conductive interconnect is coupled to the pillar and the substrate interconnect. The fill is a non-conductive photosensitive material. The fill is a photosensitive film. The substrate interconnect includes a second interconnect width that is equal or greater than the first pillar width. The conductive interconnect includes one of at least a paste, a solder and/or an enhanced solder comprising a polymeric material.

Abstract: The invention described herein relates to novel genes and their encoded proteins, termed Mutants Associated with Resistance to STI-571 (e.g., T315I Bu-Abl), and to diagnostic and therapeutic methods and compositions useful in the management of various cancers that express MARS. The invention further provides methods for identifying molecules that bind to and/or modulate the functional activity of MARS.

Abstract: The present invention relates to compositions which comprise salt of acyl glutamate as primary surfactant or primary anionic surfactant and which compositions are clear, low pH isotropic composition.

Abstract: The present invention relates to compositions comprising salt of acyl glutamate as primary surfactant or primary anionic surfactant and which further comprise specific preservative systems.

Abstract: The present invention relates to compositions comprising salt of acyl glutamate as primary surfactant or primary anionic surfactant and specific structurant polymers.

Abstract: Some features pertain to a package that includes a redistribution portion, a first die coupled to the redistribution portion, a core layer coupled to the redistribution portion, and an encapsulation layer encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer. The core layer has a higher Young's Modulus than the encapsulation layer. In some implementations, the core layer includes a glass fiber (e.g., core layer is a glass reinforced dielectric layer). In some implementations, the core layer has a Young's Modulus of about at least 15 gigapascals (Gpa). In some implementations, the first die includes a front side and a back side, where the front side of the first die is coupled to the redistribution portion. In some implementations, the first dielectric layer is a photo imageable dielectric (PID) layer.

Abstract: An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: Some features pertain to a package that includes a redistribution portion, a first die coupled to the redistribution portion, a core layer coupled to the redistribution portion, and an encapsulation layer encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer. The core layer has a higher Young's Modulus than the encapsulation layer. In some implementations, the core layer includes a glass fiber (e.g., core layer is a glass reinforced dielectric layer). In some implementations, the core layer has a Young's Modulus of about at least 15 gigapascals (Gpa). In some implementations, the first die includes a front side and a back side, where the front side of the first die is coupled to the redistribution portion. In some implementations, the first dielectric layer is a photo imageable dielectric (PID) layer.

Abstract: To achieve a package-on-package having an advantageously reduced height, a first package substrate has a window sized to receive a second package die. The first package substrate interconnects to the second package substrate through a plurality of package-to-package interconnects such that the first and second substrates are separated by a gap. The second package die has a thickness greater than the gap such that the second package die is at least partially disposed within the first package substrate's window.

Abstract: Some novel features pertain to an integrated device that includes a substrate, a first via, and a first bump pad. The first via traverses the substrate. The first via has a first via dimension. The first bump pad is on a surface of the substrate. The first bump pad is coupled to the first via. The first bump pad has a first pad dimension that is equal or less then the first via dimension. In some implementations, the integrated device includes a second via and a second bump pad. The second via traverses the substrate. The second via has a second via dimension. The second bump pad is on the surface of the substrate. The second bump pad is coupled to the second via. The second bump pad has a second pad dimension that is equal or less then the second via dimension.

Abstract: An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.

Abstract: A semiconductor package may include a lower substrate with one or more electronic components attached to a surface thereof and an upper substrate with one or more cavities wherein the upper substrate is attached to the lower substrate at a plurality of connection points with the one or more electronic components fitting within a single cavity or a separate cavity for each component that allow the overall form factor of the semiconductor package to remain smaller. The plurality of connection points provide a mechanical and electrical connection between the upper and lower substrate and may include solder joints there between as well as conductive filler particles that create an adhesive reinforcement matrix when compressed for assembly.

Abstract: A semiconductor package for a side by side die configuration may include a substrate having a cavity, a bridge interposer positioned within the cavity and having an active side facing active sides of a first die and a second die and partially horizontally overlapping the first die and the second die to provide an interconnection between the first die and the second die, and a thermal element attached to backsides of the first die and the second die to provide a heat path and heat storage for the first die and the second die.