Patents by Inventor Prayoch Tayaphat

Prayoch Tayaphat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus to prevent double semiconductor units in test socket
    Patent number: 8334764
    Abstract: Before semiconductor units are shipped to customers, each unit is electrically tested for ensuring its functionality. However, when a unit is stuck in a test area of a testing equipment, subsequent units are thereafter not properly tested. A reflective sensor is used to check for a stuck unit within the test area. The reflective sensor includes a transmitter and a receiver. In each test cycle, a signal is transmitted toward the test area. An alert indicating a stuck unit is generated when: (1) the reflectivity and/or color of the transmitted signal is different from a bare test area reflectivity and/or color, (2) a reflected signal is received outside a window of the receiver or is not received by the receiver, or (3) the reflected signal has the same light intensity as the transmitted signal. Embodiments of the present invention protect untested units from being inadvertently shipped to customers.
    Type: Grant
    Filed: September 25, 2009
    Date of Patent: December 18, 2012
    Assignee: UTAC Thai Limited
    Inventors: Suweat Nuanwan, Prayoch Tayaphat, Apichai Itdhiamornkulchai
  • Strip socket for testing and burn-in having recessed portions with material that extends across a bottom surface of the corresponding semiconductor device
    Patent number: 7696772
    Abstract: A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: April 13, 2010
    Assignee: NS Electronics Bangkok Ltd
    Inventors: Saruch Sangaunwong, Prayoch Tayaphat, Pinut Boonareeroj
  • Strip socket having a recessed portions in the base to accept bottom surface of packaged semiconductor devices mounted on a leadframe for testing and burn-in
    Patent number: 7656173
    Abstract: A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: February 2, 2010
    Assignee: UTAC Thai Limited
    Inventors: Saruch Sangaunwong, Prayoch Tayaphat, Pinut Boonareeroj
  • Testing and burn-in using a strip socket
    Publication number: 20080211072
    Abstract: A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
    Type: Application
    Filed: April 4, 2008
    Publication date: September 4, 2008
    Inventors: Saruch Sangaunwong, Prayoch Tayaphat, Pinut Boonareeroj
  • Testing and burn-in using a strip socket
    Publication number: 20080188015
    Abstract: A method and apparatus are provided for using a strip socket in testing or burn-in of semiconductor devices in a strip. In one example of the method, processing of semiconductor devices involves assembling the semiconductor devices into a strip, isolating a portion of each of the semiconductor devices of the strip, and performing operations on the strip using a strip socket, wherein the strip socket is designed to make electrical contact substantially simultaneously with each semiconductor device in the strip.
    Type: Application
    Filed: April 4, 2008
    Publication date: August 7, 2008
    Inventors: Saruch Sangaunwong, Prayoch Tayaphat, Pinut Boonareeroj