Abstract: A catheter sensor array includes a catheter, a plurality of sensor elements positioned at a distal end of the catheter, and a plurality of sensor controllers each connected to at least one of the sensor elements by a first connection. Each of the sensor controllers is positioned along a length of the catheter closer to the distal end of the catheter than to a proximal end of the catheter opposite the distal end.

Abstract: A system for sensing torque of an object includes a flange having a first length along a main axis of a main surface of the flange and a torque sensor device formed over the main surface of the flange. The torque sensor device includes a sensing portion and a plurality of measurement transducers formed over the sensing portion. The torque sensor device has a second length parallel to the main surface of the flange and a third length parallel to the main surface of the flange. The second length and the third length are each smaller than half of the first length.

Abstract: A sensor assembly includes a substrate having a first outer surface and a second outer surface opposite the first outer surface, a first die attached to the first outer surface and having a first diaphragm, a second die attached to the second outer surface and having a second diaphragm, and a full-bridge pressure sensor including a plurality of piezoresistive elements. A first subset of at least two of the plurality of piezoresistive elements is disposed on the first diaphragm and a second subset of at least two of the plurality of piezoresistive elements is disposed on the second diaphragm.

Abstract: A system for sensing torque of an object includes a flange having a first length along a main axis of a main surface of the flange and a torque sensor device formed over the main surface of the flange. The torque sensor device includes a sensing portion and a plurality of measurement transducers formed over the sensing portion. The torque sensor device has a second length parallel to the main surface of the flange and a third length parallel to the main surface of the flange. The second length and the third length are each smaller than half of the first length.

Abstract: A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.

Abstract: The present invention relates to a differential pressure sensor device, comprising a substrate, another layer formed on a main surface of the substrate and a first cavity and a second cavity separated from each other by a membrane. The first cavity is in fluid communication with a channel that is in fluid communication with a vent hole through which air can enter from an environment of the sensor device. The channel extends within the other layer or the substrate in a plane that is substantially parallel to the main surface.

Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.

Abstract: The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.

Abstract: Pressure sensor assemblies comprise a sensor body having a membrane within the body for placement in communication with a fluid from an external source and determining a pressure of the fluid. A support is connected with the body and includes a channel extending therethrough for receiving the fluid, wherein the channel is in fluid-flow communication with the membrane. A substrate is connected with the support and comprises a channel extending therethrough for receiving the fluid from an external source. The support may be formed from a material having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the support and a coefficient of thermal expansion of the external fluid source connected with the substrate. One of the substrate or the support comprises a fluid pressure mitigation feature for mitigating the transmission of a pressure spike in the fluid to protect the sensor membrane.

Abstract: Pressure sensor assemblies comprise a sensor body having a membrane within the body for placement in communication with a fluid from an external source and determining a pressure of the fluid. A support is connected with the body and includes a channel extending therethrough for receiving the fluid, wherein the channel is in fluid-flow communication with the membrane. A substrate is connected with the support and comprises a channel extending therethrough for receiving the fluid from an external source. The support may be formed from a material having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the support and a coefficient of thermal expansion of the external fluid source connected with the substrate. One of the substrate or the support comprises a fluid pressure mitigation feature for mitigating the transmission of a pressure spike in the fluid to protect the sensor membrane.

Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.

Abstract: A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.

Abstract: The present invention relates to a differential pressure sensor device, comprising a substrate, another layer formed on a main surface of the substrate and a first cavity and a second cavity separated from each other by a membrane. The first cavity is in fluid communication with a channel that is in fluid communication with a vent hole through which air can enter from an environment of the sensor device. The channel extends within the other layer or the substrate in a plane that is substantially parallel to the main surface.

Abstract: A pressure sensor including a substrate having a first housing defining a gas-filled interior cavity arranged thereon. An elastic sealing element is attached to a free end of the first housing and generally covers an open end of the interior cavity for sealing the interior cavity with respect to an external environment. A portion of the elastic sealing element is configured to be moveable in response to a pressure acting thereon. A semiconductor die is arranged on the substrate and defines a pressure sensing diaphragm exposed to the gas occupying the interior cavity.

Abstract: The present invention relates to a sensor arrangement, to a corresponding method of assembling such a sensor arrangement, and to a sensor system. The sensor arrangement comprises at least one transducer element for monitoring at least one measurand and generating an electrical output signal correlated with the at least one measurand; and a sensor substrate comprising the transducer element. The sensor substrate is mountable on a circuit carrier in a way that a media channel penetrating the circuit carrier allows access of the at least one measurand to the transducer element. The circuit carrier has an electrically conductive solderable first sealing pattern which surrounds the media channel at least partly and which is aligned with a solderable second sealing pattern arranged on the sensor substrate, so that a soldered sealing connection, which at least partly surrounds the media channel, is formed between the first sealing pattern and the second sealing pattern.

Abstract: A sensor for measuring, for example, the pressure of a gas or other fluid comprising a glass substrate having an aperture defined therethrough. A semiconductor die defining a diaphragm is anodically bonded to the glass substrate such that the diaphragm is exposed via the aperture. At least one electrically conductive element in electrical communication with the semiconductor die is arranged on a surface of the glass substrate.

Abstract: A pressure sensor including a substrate having a first housing defining a gas-filled interior cavity arranged thereon. An elastic sealing element is attached to a free end of the first housing and generally covers an open end of the interior cavity for sealing the interior cavity with respect to an external environment. A portion of the elastic sealing element is configured to be moveable in response to a pressure acting thereon. A semiconductor die is arranged on the substrate and defines a pressure sensing diaphragm exposed to the gas occupying the interior cavity.

Abstract: A sensor for measuring, for example, the pressure of a gas or other fluid comprising a glass substrate having an aperture defined therethrough. A semiconductor die defining a diaphragm is anodically bonded to the glass substrate such that the diaphragm is exposed via the aperture. At least one electrically conductive element in electrical communication with the semiconductor die is arranged on a surface of the glass substrate.

Abstract: There is disclosed a capacitive sensor on a passivation layer of a semiconductor circuit such as an ASIC, and a method for manufacturing such sensor. The system and method may comprise: forming a bottom electrode layer and landing pad on a portion of the passivation layer located over active circuitry of the ASIC; forming a gas sensitive layer onto the bottom electrode layer and the landing pad; creating a via through the gas sensitive layer to expose a portion of the landing pad; forming a top electrode layer onto the gas sensitive layer, wherein the top electrode layer completely overlays a surface area of the bottom electrode layer, and wherein the forming process for the top electrode layer deposits a portion of the top electrode layer into the via hole, thereby forming an electrical connection between the top electrode layer and the landing pad.

Abstract: There is disclosed a capacitive sensor on a passivation layer of a semiconductor circuit such as an ASIC, and a method for manufacturing such sensor. The system and method may comprise: forming a bottom electrode layer and landing pad on a portion of the passivation layer located over active circuitry of the ASIC; forming a gas sensitive layer onto the bottom electrode layer and the landing pad; creating a via through the gas sensitive layer to expose a portion of the landing pad; forming a top electrode layer onto the gas sensitive layer, wherein the top electrode layer completely overlays a surface area of the bottom electrode layer, and wherein the forming process for the top electrode layer deposits a portion of the top electrode layer into the via hole, thereby forming an electrical connection between the top electrode layer and the landing pad.