Patents by Inventor Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI

Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method using porosified surfaces for making stacked structures
    Patent number: 9272899
    Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
    Type: Grant
    Filed: January 7, 2015
    Date of Patent: March 1, 2016
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Huamao Lin, Pradeep Yelehanka
  • BONDING METHOD USING POROSIFIED SURFACES FOR MAKING STACKED STRUCTURES
    Publication number: 20150115453
    Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
    Type: Application
    Filed: January 7, 2015
    Publication date: April 30, 2015
    Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Huamao LIN, Pradeep YELEHANKA
  • Bonding method using porosified surfaces for making stacked structures
    Patent number: 8940616
    Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: January 27, 2015
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Huamao Lin, Pradeep Yelehanka
  • BONDING METHOD USING POROSIFIED SURFACES FOR MAKING STACKED STRUCTURES
    Publication number: 20140030847
    Abstract: A bonded device having at least one porosified surface is disclosed. The porosification process introduces nanoporous holes into the microstructure of the bonding surfaces of the devices. The material property of a porosified material is softer as compared to a non-porosified material. For the same bonding conditions, the use of the porosified bonding surfaces enhances the bond strength of the bonded interface as compared to the non-porosified material.
    Type: Application
    Filed: July 27, 2012
    Publication date: January 30, 2014
    Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Huamao LIN, Pradeep YELEHANKA
  • Package interconnects
    Patent number: 8513767
    Abstract: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.
    Type: Grant
    Filed: March 21, 2011
    Date of Patent: August 20, 2013
    Assignee: Globalfoundries Singapore Pte. Ltd.
    Inventors: Rama Krishna Kotlanka, Rakesh Kumar, Premachandran Chirayarikathuveedu Sankarapillai, Pradeep Ramachandramurthy Yelehanka
  • PACKAGE INTERCONNECTS
    Publication number: 20120241901
    Abstract: A method for forming a device is disclosed. A support substrate having first and second major surfaces is provided. An interconnect is formed through the first and second major surfaces in the support substrate. The interconnect has first and second portions. The first portion extends from one of the first or second major surfaces and the second portion extends from the other of the first and second major surfaces. The interconnect includes a partial via plug having a conductive material in a first portion of the interconnect. The via plug has a bottom at about an interface of the first and second portions. The second portion of the interconnect is heavily doped with dopants of a first polarity type.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 27, 2012
    Applicant: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
    Inventors: Rama Krishna KOTLANKA, Rakesh KUMAR, Premachandran CHIRAYARIKATHUVEEDU SANKARAPILLAI, Pradeep Ramachandramurthy YELEHANKA