Patents by Inventor Premakaran Boaz

Premakaran Boaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder composition
    Publication number: 20060147337
    Abstract: The present invention relates to a lead-free solder composition having a low coefficient of thermal expansion to reduce the likelihood of thermal shock to a glass substrate. The solder composition includes a granular material added to lead-free solder where the granular material may include fused silica, zirconium oxide, Invar®, or any wettable, lead-free alloy such as 36% weight nickel or 64% weight iron and the solder may include tin, silver and bismuth. When a component is soldered to a glass substrate by the present invention and exposed to a substantial change in climatic temperature the granular material counteracts and adsorbs the stress caused by contraction of the solder, thereby preventing thermal shock to the glass substrate.
    Type: Application
    Filed: March 17, 2004
    Publication date: July 6, 2006
    Applicant: Antaya Technologies Corporation
    Inventors: Premakaran Boaz, John Pereira
  • Lead-free solder composition for substrates
    Publication number: 20050069725
    Abstract: A lead-free solder composition for soldering onto a substrate includes a solder having Tin (Sn) and Silver (Ag); and an additive having a low coefficient of thermal expansion.
    Type: Application
    Filed: December 23, 2003
    Publication date: March 31, 2005
    Inventor: Premakaran Boaz