Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.

Abstract: An optocoupler having optical lens layer is disclosed. The optocoupler may comprise an optical emitter, an optical receiver, an isolation layer, a lens layer and a substantially transparent encapsulant. The lens layer may be integrally formed within the optical receiver. Alternatively, the lens layer may be formed integrally with the isolation layer, or the lens layer may be an optical film attached on the optical receiver. The substantially transparent encapsulant may encapsulate at least partially the optical emitter, the optical receiver and the isolation layer. The isolation layer may be inserted to the substantially transparent encapsulant, making the substantially transparent encapsulant into two compartments. In another embodiment, an electronic system having optocoupler is disclosed.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more light guides that facilitate an efficient transfer of optical signals from a light source to a light detector.

Abstract: An optocoupler having optical lens layer is disclosed. The optocoupler may comprise an optical emitter, an optical receiver, an isolation layer, a lens layer and a substantially transparent encapsulant. The lens layer may be integrally formed within the optical receiver. Alternatively, the lens layer may be formed integrally with the isolation layer, or the lens layer may be an optical film attached on the optical receiver. The substantially transparent encapsulant may encapsulate at least partially the optical emitter, the optical receiver and the isolation layer. The isolation layer may be inserted to the substantially transparent encapsulant, making the substantially transparent encapsulant into two compartments. In another embodiment, an electronic system having optocoupler is disclosed.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more light guides and an insulative tape that helps define a shape of the one or more light guides.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing optocouplers are disclosed. Even more specifically, methods and devices that deposit one or more encapsulant materials on optocouplers are disclosed. The encapsulant material may include silicone and the devices used to deposit the silicone may be configured to simultaneously deposit the silicone on different sides of the optocoupler, thereby reducing manufacturing steps and time.

Abstract: Various embodiments of methods and devices are provided for an optocoupler comprising an optically reflective compound comprising silicone and inner and outer surfaces. A molding compound surrounds and encapsulates at least portions of the outer surfaces of the optically reflective compound to form an enclosure. A surface functional coating layer is provided in the optically reflective compound to promote adhesion and increase breakdown voltages between inner walls of the enclosure and the outer surfaces of the optically reflective compound.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing optocouplers are disclosed. Even more specifically, methods and devices that deposit one or more encapsulant materials on optocouplers are disclosed. The encapsulant material may include silicone and the devices used to deposit the silicone may be configured to simultaneously deposit the silicone on different sides of the optocoupler, thereby reducing manufacturing steps and time.

Abstract: The present invention relates to methods for joining and for improving interfacial strength of joints in objects of fibre-containing composite materials, such as epoxy/glass fibre composite materials of a wind turbine blade, as well as fibre reinforced composite materials, laminates and other interconnected objects prepared by this method. In particular wind turbine blades prepared by this method are described. The present invention further relates to robots and robotic tools for carrying out the described methods for joining objects of fibre-containing composite materials.

Abstract: The invention provides a wind turbine component having an exposed surface made of a hydrophobic material and having a surface texture providing a Water Contact Angle (CA) of at least 150. Due to the combination between a CA over 150 and the hydrophobic material, the component becomes less vulnerable to ice formation etc. The invention further provides a method of preventing ice formation, a method of reducing noise and a blade for reducing noise from a wind turbine.

Abstract: A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolded surfaces facing an acid source for supplying an acid solution, contacting the unmolded surfaces with the acid solution for a sufficient time to remove the excess encapsulation material from the unmolded surfaces while substantially avoiding contact with molded surfaces thereof, and thereafter removing the substrate from contact with the acid solution.

Abstract: A method is provided for removing excess encapsulation material from unmolded surfaces of a molded substrate including semiconductor packages by utilizing an acid solution. The method comprises the steps of mounting the substrate to a holding device with the unmolded surfaces facing an acid source for supplying an acid solution, contacting the unmolded surfaces with the acid solution for a sufficient time to remove the excess encapsulation material from the unmolded surfaces while substantially avoiding contact with molded surfaces thereof, and thereafter removing the substrate from contact with the acid solution.