Patents by Inventor Premkumar R. Hingorany

Premkumar R. Hingorany has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid/microwave enclosures and method of making same
    Patent number: 5435058
    Abstract: A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
    Type: Grant
    Filed: July 17, 1992
    Date of Patent: July 25, 1995
    Assignee: Texas Instruments Incorporated
    Inventors: Henry F. Breit, Premkumar R. Hingorany, John A. Haug
  • Hybrid/microwave enclosures and method of making same
    Patent number: 5138114
    Abstract: A method of forming enclosures for microwave and hybrid devices and the enclosure itself wherein the metals to be joined are thin (i.e., less than 40 mils thick) and/or thick (up to several inches) and wherein metallurgical hermetic bonds are provided between adjacent metals which are generally difficult to bond to each other and may be bonded by a select number of bonding processes.
    Type: Grant
    Filed: September 27, 1990
    Date of Patent: August 11, 1992
    Assignee: Texas Instruments Incorporated
    Inventors: Henry F. Breit, Premkumar R. Hingorany, John A. Haug
  • Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member
    Patent number: 4811166
    Abstract: A heat dissipating pad or support member for mounting a semiconductor device in an electrical circuit has a metal core with a relatively low coefficient of thermal expansion preferably lower than that of the semiconductor device and has a thermally conducting, corrosion resistant metal coating with relatively greater thermal conductivity than the core. The thermally conducting coating is metallurgically bonded to top, bottom and two lateral surfaces of the core with a selected thickness to cooperate with the core in providing an outer surface portion of the member over the top of the core having an effective coefficient of thermal expansion substantially corresponding to the semiconductor device to reliably mount the semiconductor device thereon.
    Type: Grant
    Filed: July 2, 1986
    Date of Patent: March 7, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Juan M. Alvarez, Henry F. Breit, Steven E. Levy, Premkumar R. Hingorany