Patents by Inventor Prerna S. GORADIA

Prerna S. GORADIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Uniform crack-free aluminum deposition by two step aluminum electroplating process
    Patent number: 10407789
    Abstract: In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 10, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Balaji Ganapathy, Ankur Kadam, Prerna S. Goradia, Laksheswar Kalita, Tapash Chakraborty, Vijay Bhan Sharma
  • Method for forming yttrium oxide on semiconductor processing equipment
    Patent number: 10253406
    Abstract: The present disclosure generally relates to methods of electro-chemically forming yttria or yttrium oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of yttria or yttrium oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited yttria or yttrium oxide thereon.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 9, 2019
    Assignee: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Prerna S. Goradia, Geetika Bajaj, Yogita Pareek, Yixing Lin, Dmitry Lubomirsky, Ankur Kadam, Bipin Thakur, Kevin A. Papke, Kaushik Vaidya
  • Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
    Patent number: 10233554
    Abstract: The present disclosure generally relates to methods of electro-chemically forming aluminum or aluminum oxide. The methods may include the optional preparation of a an electrochemical bath, the electrodepositon of aluminum or aluminum oxide onto a substrate, removal of solvent form the surface of the substrate, and post treatment of the substrate having the electrodeposited aluminum or aluminum oxide thereon.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: March 19, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yogita Pareek, Laksheswar Kalita, Geetika Bajaj, Kevin A. Papke, Ankur Kadam, Bipin Thakur, Yixing Lin, Dmitry Lubomirsky, Prerna S. Goradia
  • UNIFORM CRACK-FREE ALUMINUM DEPOSITION BY TWO STEP ALUMINUM ELECTROPLATING PROCESS
    Publication number: 20180163317
    Abstract: In one implementation, a method of depositing a material on a substrate is provided. The method comprises positioning an aluminum-containing substrate in an electroplating solution, the electroplating solution comprising a non-aqueous solvent and a deposition precursor. The method further comprises depositing a coating on the aluminum-containing substrate, the coating comprising aluminum or aluminum oxide. Depositing the coating comprises applying a first current for a first time-period to nucleate a surface of the aluminum-containing substrate and applying a second current for a second time-period, wherein the first current is greater than the second current and the first time-period is less than the second time-period to form the coating on the nucleated surface of the aluminum-containing substrate.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 14, 2018
    Inventors: Balaji GANAPATHY, Ankur KADAM, Prerna S. GORADIA, Laksheswar KALITA, Tapash CHAKRABORTY, Vijay Bhan SHARMA