Abstract: Embodiments of the present disclosure relate to projection stabilization systems and maskless lithography systems having projection stabilization systems. The projection stabilization system compensates for propagating vibrations that move image projection systems (IRS's). The IRS's are in a processing positon prior to operation of the maskless lithography process. One or more stiffeners are coupled to the IPS. The one or more stiffeners apply pressure to flexures coupled to each stiffener. The flexures are coupled to the IPS to provide stabilization to the IPS during the operations of the maskless lithography process. For example, the one or more of stiffeners protect the IPS from vibrations that propagate through the system during operation.

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.

Abstract: An osseointegrated abutment support socket for a residual limb in which an osseointegrated abutment has been implanted is described. The osseointegrated abutment support socket may include a distal socket base assembly, multiple longitudinal struts and a percutaneous site protector. The distal socket base assembly may include a base plate, a collar extending proximally from the base plate and forming a receptacle for receiving a distal end of the osseointegrated abutment, and a strut support ring disposed around the collar. The struts are connected at their distal ends to the strut support ring and extend proximally upward. The percutaneous site protector contacts a distal surface of the residual limb near a percutaneous site where the distal end of the osseointegrated abutment exits the residual limb.

Abstract: An intra-frame positioning sling may be disposed internally within a prosthetic socket frame. The sling may include one or more proximal suspension portions adapted to suspend from a proximal aspect of the frame and a tensioning system. The sling may include a first longitudinal side with one or more proximal suspension portions and an opposite longitudinal side that includes the residual limb interfacing or force application portion of the sling. When the tensioning system is tensioned, the sling is pulled toward the first longitudinal side of the prosthetic socket frame. A set of two positioning slings may be rigged in a transfemoral prosthetic socket frame; one sling applies force on a medial side of a hosted residual limb, and the other sling applies force on the lateral side.

Abstract: A transtibial prosthetic socket frame may include a distal base assembly having a base plate, a carriage configured to support a socket suspension arrangement, and a distal prosthetic component connector. The distal base assembly supports a set of struts that includes two anterior struts and a single posterior strut. The set of struts and distal base assembly collectively define a prosthetic socket cavity having a central longitudinal axis and a residual limb hosting volume. The distal prosthetic component connector has a connecting adapter that is rotatable with respect to the prosthetic socket, and moveable with respect to the base plate between being aligned with the prosthetic socket's central longitudinal axis and a position offset therefrom.

Abstract: A transtibial prosthetic socket frame may include a distal base assembly having a base plate, a carriage configured to support a socket suspension arrangement, and a distal prosthetic component connector. The distal base assembly supports a set of struts that includes two anterior struts and a single posterior strut. The set of struts and distal base assembly collectively define a prosthetic socket cavity having a central longitudinal axis and a residual limb hosting volume. The distal prosthetic component connector has a connecting adapter that is rotatable with respect to the prosthetic socket, and moveable with respect to the base plate between being aligned with the prosthetic socket's central longitudinal axis and a position offset therefrom.

Abstract: An intra-frame positioning sling may be disposed internally within a prosthetic socket frame. The sling may include one or more proximal suspension portions adapted to suspend from a proximal aspect of the frame and a tensioning system. The sling may include a first longitudinal side with one or more proximal suspension portions and an opposite longitudinal side that includes the residual limb interfacing or force application portion of the sling. When the tensioning system is tensioned, the sling is pulled toward the first longitudinal side of the prosthetic socket frame. A set of two positioning slings may be rigged in a transfemoral prosthetic socket frame; one sling applies force on a medial side of a hosted residual limb, and the other sling applies force on the lateral side.

Abstract: An osseointegrated abutment support socket for a residual limb in which an osseointegrated abutment has been implanted is described. The osseointegrated abutment support socket may include a distal socket base assembly, multiple longitudinal struts and a percutaneous site protector. The distal socket base assembly may include a base plate, a collar extending proximally from the base plate and forming a receptacle for receiving a distal end of the osseointegrated abutment, and a strut support ring disposed around the collar. The struts are connected at their distal ends to the strut support ring and extend proximally upward. The percutaneous site protector contacts a distal surface of the residual limb near a percutaneous site where the distal end of the osseointegrated abutment exits the residual limb.