Patents by Inventor Preston T. MEYERS

Preston T. MEYERS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TSV-less die stacking using plated pillars/through mold interconnect
    Patent number: 11296052
    Abstract: A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Preston T. Meyers, Javier A. Falcon, Shawna M. Liff, Joe R. Saucedo, Adel A. Elsherbini, Albert S. Lopez, Johanna M. Swan
  • TSV-LESS DIE STACKING USING PLATED PILLARS/THROUGH MOLD INTERCONNECT
    Publication number: 20200212012
    Abstract: A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.
    Type: Application
    Filed: September 30, 2017
    Publication date: July 2, 2020
    Inventors: Preston T. MEYERS, Javier A. FALCON, Shawna M. LIFF, Joe R. SAUCEDO, Adel A. ELSHERBINI, Albert S. LOPEZ, Johanna M. SWAN