Abstract: The present teachings relate to a system for handling semiconductor substrates with end effector devices. In one embodiment a plurality of orifices situated on a robot end effector are used to manipulate a highly shaped semiconductor wafer or substrate. The orifices may create vacuum forces on the substrate to enable the handling of the substrate. An end effector may have one or more primary orifices and may have one or more additional secondary orifices. The one or more primary orifices may be controllable and may have a high vacuum flow, greater than about 1 ft3/min.

Abstract: A system for handling substrates held in a carrier, the system comprising a robot having an articulating robotic arm, a processor for controlling the robotic arm, an end effector attached to a moveable end of the robotic arm, the end effector comprising a blade having a first end and a second end, the blade having an active area for sensing a distance between the end and the substrate, and a passive gripper attached to the first end of the blade and an active gripper attached to the second end of the blade.

Abstract: A system comprising a first robotic arm assembly for capturing and releasing a semiconductor wafer, a second robotic arm for capturing and releasing an interleaf, and a controller for actuation of the first and second robotic arms, the first and second robotic arms operating substantially simultaneously. At least one robotic arm can include a transfer arm, and a counterweight attached to a first end of the transfer arm and an end effector attached to a second, opposite end of the transfer arm. Two robotic arms permit the system to carry out the steps substantially simultaneously and therefore increase throughput significantly.

Abstract: A method for holding and orienting a wafer having an alignment feature, the method includes gripping a wafer with an end effector attached to an end of a robot arm, the end effector including a gripping mechanism which includes a first contacting member, a second contacting member, and a drive element, and wherein gripping includes increasing and decreasing the space between the first and second contacting members, the method also including rotating the wafer about an axis that is perpendicular to the plane of the wafer and sensing the alignment feature on the wafer as the gripping mechanism rotates the wafer.

Abstract: An apparatus for holding and orienting a wafer includes a movable robot arm, and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation holds and rotates the wafer about an axis that is perpendicular to the plane of the wafer, wherein the gripping mechanism comprises a first contacting member, and a second contacting member, and a drive member arranged to grip opposing edges of the wafer, and wherein the drive member comprises a first pair of rollers.

Abstract: An apparatus for holding and orienting a wafer having an alignment feature, and including a movable robot arm; and an end effector attached to an end of the robot arm, the end effector including a gripping mechanism which during operation both holds the wafer and rotates it about an axis that is perpendicular to the plane of the wafer and a sensing element for detecting the alignment feature on the wafer as the gripping mechanism rotates the wafer past the sensing element.