Patents by Inventor Priscilla Diep LaRosa

Priscilla Diep LaRosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing using time share control
    Patent number: 11931854
    Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: March 19, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Jimin Zhang, Jianshe Tang, Brian J. Brown, Wei Lu, Priscilla Diep LaRosa
  • Chemical mechanical polishing using time share control
    Patent number: 11883923
    Abstract: A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: January 30, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Jimin Zhang, Jianshe Tang, Brian J. Brown, Wei Lu, Priscilla Diep LaRosa