Abstract: A glucose sensor employs a programmable glucose sensor array of a relatively large number of nanoelectronic devices (e.g. semiconductor field-effect devices) having control surfaces functionalized with a glucose-reactive substance and generating sensing signals indicative of sensed glucose level of a bodily fluid. The devices arc divided into sub-sets sequentially enabled over successive intervals to achieve overall sensor lifetime many times longer than the lifetime of any single device in operation.

Abstract: Mechanical resonating structures are used to generate signals having a target frequency with low noise. The mechanical resonating structures may generate output signals containing multiple frequencies which may be suitably combined with one or more additional signals to generate the target frequency with low noise. The mechanical resonating structures may be used to form oscillators.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Oscillators including mechanical resonators are described, as are methods of operating the oscillators such that the mechanical resonator exhibits non-linear behavior. The non-linear behavior may include multiple stable states, for instance being bi-stable. The non-linear behavior may exhibit hysteresis. The mechanical resonator may be driven to operate in a desired portion of the non-linear operating regime.

Abstract: Mechanical resonating structures are used to generate signals having a target frequency with low noise. The mechanical resonating structures may generate output signals containing multiple frequencies which may be suitably combined with one or more additional signals to generate the target frequency with low noise. The mechanical resonating structures may be used to form oscillators.

Abstract: Coupled timing oscillators are described. The coupling may be electrical, mechanical, or electromechanical in some instances. In some cases, the timing oscillators include mechanical resonators. Any number of timing oscillators may be coupled. The coupled timing oscillators may be operated cooperatively to produce an oscillating signal with improved signal characteristics, such as phase noise and jitter.

Abstract: An electromechanical resonating structure, including: first level major elements coupled to each other to form a second or higher level hierarchy; and first level sub-micron size minor elements with a characteristic frequency and coupled to each of the first level major elements to form a second level hierarchy in which a signal is effectively amplified by vibrating each of the plurality of major elements in at least one mode determined by the geometry and dimensions of the first level sub-micron minor elements.

Abstract: In one embodiment, an apparatus comprises a micromechanical gyroscope and a circuit. The micromechanical gyroscope is configured to be excited in a first mode by a drive signal, and configured to be excited in a second mode by a gyroscopic effect. The circuit is coupled to the micromechanical gyroscope and configured to detect the gyroscopic effect when the micromechanical gyroscope is in the second mode.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: An apparatus is described that includes a substrate having a first plate and a second plate. The first plate and the second plate collectively have a first mode when excited by a drive signal and have a second mode when excited by a gyroscopic effect. The first and second plates each include a temperature-compensated stack having first and third layers that have a stiffness that increases with increasing temperature over a temperature range with a second layer between the first and third layers, where the second layer is formed from a different material than the first and third layers.

Abstract: A sensor system for detecting a chemical or biological species includes a sensing element and a bias and measurement circuit. The sensing element includes nanochannels having an outer surface functionalized for interaction with the species to create a surface potential, and each having a sufficiently small cross section to exhibit a shift of differential conductance into a negative bias operating region by a shift amount dependent on the surface potential. The bias and measurement circuit applies a bias voltage across two ends of the nanochannels sufficiently negative to achieve a desired dependence of the differential conductance on the surface potential. The dependence has a steeply sloped region of high amplification substantially greater than a reference amplification at a zero-bias condition, thus achieving relatively high signal-to-noise ratio. The bias and measurement circuit converts the measured differential conductance into a signal indicative of presence or activity of the species.

Abstract: Micromechanical resonating devices, as well as related methods, are described herein. The resonating devices can include a micromechanical resonating structure, an actuation structure that actuates the resonating structure, and a detection structure that detects motion of the resonating structure. A bias structure separated from the mechanical resonating structure is provided to tune a resonance frequency of the mechanical resonating structure.

Abstract: Mechanical resonating structures are used to generate signals having a target frequency with low noise. The mechanical resonating structures may generate output signals containing multiple frequencies which may be suitably combined with one or more additional signals to generate the target frequency with low noise. The mechanical resonating structures may be used to form oscillators.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A bank of nano electromechanical integrated circuit filters. The bank of integrated circuit filters comprising a silicon substrate; a sacrificial layer; a device layer including at least two resonators, wherein the at least two resonators include sub-micro excitable elements and wherein the at least two resonators posses a fundamental mode frequency as well as a collective mode frequency and wherein the collective mode frequency of the at least two resonators is determined by the fundamental frequency of the sub-micron elements. At least one switch connects to the bank of integrated circuit filters.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: Apparatus and methods of connecting mechanical resonating structures to a body are described. Multi-element anchors may include a flexible portion that flexes when the mechanical resonating structure vibrates. The flexible portion may have a length related to the resonance frequency of the mechanical resonating structures. Some of the multi-element anchors include elements that are oriented perpendicularly to each other. MEMS incorporating such structures are also described.