Patents by Inventor Pritulkumar Shah

Pritulkumar Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compact package assembly and methods for the same
    Patent number: 10197624
    Abstract: A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: February 5, 2019
    Assignee: Intel Corporation
    Inventors: Pritulkumar Shah, Michael Likov, Frank R. Deweese
  • COMPACT PACKAGE ASSEMBLY AND METHODS FOR THE SAME
    Publication number: 20170181284
    Abstract: A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Pritulkumar Shah, Michael Likov, FranK R. Deweese