Patents by Inventor Priyank Jain

Priyank Jain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135460
    Abstract: Systems and methods are disclosed for processing medical claims to determine vector embeddings for predictive analytics and fraud detection. The method includes receiving claim data for a medical claim, the claim data comprising a plurality of medical codes. A plurality of embedding vectors is determined based on the plurality of medical codes, each embedding vector determined based on a corresponding medical code. A multi-layered matrix is determined based on the plurality of embedding vectors determined for the plurality of medical codes, wherein the multi-layered matrix is representative of the medical claim. One or more actions such as predictive analytics and fraud detection are performed based on the multi-layered matrix.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Applicant: Optum, Inc.
    Inventors: Rama Krishna SINGH, Ravi PANDE, Priyank JAIN
  • Publication number: 20240020946
    Abstract: As described herein, various embodiments of the present invention disclose techniques that improve efficiency of performing image-based machine learning operations on large images while limiting accuracy drawbacks of partial processing of those large images by using composite-tiled image embeddings for composite-tiled images generated by merging multiple tiled images that are generated using multiple tiling mechanisms. For example, in some embodiments, given an input image that comprises R image regions, each tiled image comprises N selected image regions of the R image regions that are selected in accordance with a tiling mechanism (where N<R). In this way, given T tiling mechansisms, T tiled images are generated, and the T tiled images are merged to generate a composite-tiled image. Accordingly, by using T tiling mechansisms, various embodiments enable reducing the size of feature data provided to an image processing machine learning model by selecting non-holistic subsets of an input image.
    Type: Application
    Filed: July 13, 2022
    Publication date: January 18, 2024
    Inventors: Rama Krishna Singh, Ravi Pande, Priyank Jain
  • Publication number: 20230017734
    Abstract: Various embodiments of the present invention provide methods, apparatus, systems, computing devices, computing entities, and/or the like for performing predictive structural analysis. Certain embodiments of the present invention utilize systems, methods, and computer program products that perform predictive structural analysis using at least one of techniques using time bound code transition likelihood data objects, techniques using cross-code relationship values, techniques using augmented entity-code occurrence data objects, techniques using per-pathway text representations of inferred occurrence pathways of a one or more individual historic code occurrences, techniques using polygenic risk score (PRS) measures, and/or the like.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Inventors: Rama Krishna Singh, Ravi Pande, Priyank Jain
  • Patent number: 11454949
    Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: September 27, 2022
    Assignee: KLA Corporation
    Inventors: Shivam Agarwal, Hariharasudhan Koteeswaran, Priyank Jain, Suvi Murugan, Yuan Zhong
  • Patent number: 11393118
    Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: July 19, 2022
    Assignee: KLA CORPORATION
    Inventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
  • Publication number: 20220188664
    Abstract: There is a need for more accurate and more efficient predictive data analysis steps/operations. This need can be addressed by, for example, techniques for efficient predictive data analysis steps/operations. In one example, a method includes mapping a primary event having a primary event code to a related subset of a plurality of candidate secondary events by at least processing one or more lifecycle-related attributes for the primary event code using a lifecycle inference machine learning model to detect an inferred lifecycle for the primary event.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 16, 2022
    Inventors: Rama Krishna Singh, Priyank Jain, Ravi Pande
  • Publication number: 20200402252
    Abstract: Using data about the geometry of the wafer, the geometry of the wafer is measured along at least three diameters originating at different points along a circumference of the wafer. A characterization of the geometry of the wafer is determined using the three diameters. A probability of wafer clamping failure for the wafer can be determined based on the characterization.
    Type: Application
    Filed: June 9, 2020
    Publication date: December 24, 2020
    Inventors: Shivam Agarwal, Priyank Jain, Yuan Zhong, Chiou Shoei Chee
  • Publication number: 20190302734
    Abstract: A system includes a controller with processors configured to execute an auto-correlation module embodied in one or more sets of program instructions stored in memory. The auto-correlation module is configured to cause the processors to receive one or more patterned wafer geometry metrics, receive wafer characterization data from one or more characterization tools, determine a correlation between the one or more patterned wafer geometry metrics and the wafer characterization data, generate a ranking of the one or more patterned wafer geometry metrics based on the determined correlation, construct a composite metric model from a subset of the one or more patterned wafer geometry metrics based on the ranking of the one or more patterned wafer geometry metrics, generate one or more composite wafer metrics from the composite metric model, and generate a statistical process control output based on the one or more composite wafer metrics.
    Type: Application
    Filed: January 23, 2019
    Publication date: October 3, 2019
    Inventors: Shivam Agarwal, Hariharasudhan Koteeswaran, Priyank Jain, Suvi Murugan, Yuan Zhong
  • Patent number: 9830169
    Abstract: A computer implemented method and apparatus for remotely delivering software. The method comprises installing a provisioning application on a first device, in response to accessing an advertisement for a software product; determining one or more second devices that are synchronized with the first device, wherein the one or more second devices are remote from the first device, and wherein the one or more synchronized second devices are not registered with a software provider of the software product; registering the one or more synchronized second devices with the software provider of the software product; receiving, from the first device, a selection of one or more of the registered devices for installation of the software product; and directing installation of the software product on the one or more selected registered devices.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: November 28, 2017
    Assignee: ADOBE SYSTEMS INCORPORATED
    Inventors: Amrita Chakrabarti, Ashish Kumar Agarwal, Priyank Jain, Sanjeev Kumar Biswas, Vikalp Gupta
  • Publication number: 20150095905
    Abstract: A computer implemented method and apparatus for remotely delivering software. The method comprises installing a provisioning application on a first device, in response to accessing an advertisement for a software product; determining one or more second devices that are synchronized with the first device, wherein the one or more second devices are remote from the first device, and wherein the one or more synchronized second devices are not registered with a software provider of the software product; registering the one or more synchronized second devices with the software provider of the software product; receiving, from the first device, a selection of one or more of the registered devices for installation of the software product; and directing installation of the software product on the one or more selected registered devices.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: Adobe Systems Incorporated
    Inventors: Amrita Chakrabarti, Ashish Kumar Agarwal, Priyank Jain, Sanjeev Kumar Biswas, Vikalp Gupta