Abstract: An apparatus, method, and system for integrated circuit packaging having an offset solder bump are disclosed herein. A semiconductor substrate has a bond pad and a passivation layer located on an active surface thereof. A solder terminal contacts both the bond pad and passivation layer. A solder bump contacts the solder terminal and is positioned laterally offset from the bond pad.

Abstract: An integrated circuit (IC) package that includes an on-package voltage regulation module (VRM). An IC die is flip-bounded to a substrate having a plurality of connections to couple to a socket or to be mounted directly to a circuit board. An integrated heat spreader (IHS) is thermally coupled to the IC die and coupled (both electrically and mechanically) to the substrate. A VRM is coupled to the IHS. The IHS, which serves as an interconnect member, includes interconnect provisions for electrically coupling the VRM to the substrate. In one embodiment, the body of the IHS serves as a ground plane, while a separate interconnect layer includes electrical traces for routing electrical signals between the VRM and substrate. The VRM may comprise a detachable package that is coupled to the IHS via one of several means including fasteners, edge connectors and a parallel coupler.