Abstract: A slit valve assembly includes a housing having an opening in a wall of the housing and through which a substate is to be transferred. The opening includes a first side to attach to a slit tunnel. A first channel is formed adjacent to a top surface of the opening. First plurality of gas holes extend from the first channel and is oriented so as to create a first gas curtain from a pressurized gas at a first angle towards a process chamber. A second channel is formed adjacent to a bottom surface of the opening. A second plurality of gas holes extend from the second channel and is oriented so as to create a second gas curtain from the pressurized gas at a second angle towards the chamber that is to intersect with, or be offset from, the first gas curtain to protect the slit tunnel from process chemistries.

Abstract: Semiconductor processing chambers and systems, as well as methods of cleaning such chambers and systems are provided. Processing chambers and systems include a chamber body that defines a processing region. Processing chambers and systems include an enhancement liner positioned within the chamber body that includes an interior portion, an exterior portion, and a plurality of apertures. The enhancement liner defines a liner volume between the interior portion and the exterior portion, and a distribution gap is defined between the enhancement liner and a sidewall of the chamber body. Processing chambers and systems include a faceplate disposed vertically above the enhancement liner. Processing chambers and systems include a cleaning gas source coupled with distribution gap through an inlet in the sidewall of the chamber body.