Abstract: A PCB structure is provided. The material of the adhesion is replaced by silicone from conventional Epoxy or Acrylic acid. The problems of unclear signal and voltage drop caused by moisture are overcame due to the characteristic of non-polar and non-hydrophile of the silicone. Also, the silicone layer has two modified silicone layers disposed two sides thereon to enhance the adhesion between the silicone and substrate/metal layer. The problems of producing bubbles or easy to peel off are solved.

Abstract: A side package structure of electronic modules includes a upper substrate, a lower substrate and a sealing frame. The sealing frame is disposed between the upper substrate and the lower substrate to form a space thereof. The sealing frame is made of silicone to improve moisture barrier and to retard the permeation of water vapor. Also, the erosion of polar solvent and plasticizer is avoided due to the characteristic of the silicone.

Abstract: An electricity supply element and the ceramic separator thereof are provided. The ceramic separator is adapted to separate two electrode layers of the electricity supply element for permitting ion migration and electrical separation. The ceramic separator is made of ceramic particulates and the adhesive. The adhesive employs dual binder system, which includes linear polymer and cross-linking polymer. The adhesion and heat tolerance are enhanced by the characteristic of the two type of polymers. The respective position of the two electrode layers are maintained during high operation temperature to improve the stability, and battery performance. Also, the ceramic separator enhances the ion conductivity and reduces the possibility of the micro-short to increase practical utilization.

Abstract: An electricity supply system and electricity supply element thereof is provided. The electricity supply system is made of a plurality of electricity supply elements by stacking or rolling. Each electricity supply element includes a substrate, two current collector layers and two active material layers. The substrate has a plurality of holes and the current collector layers, the active material layers are disposed on two sides respectively. Therefore, the ion migration is permitted by the holes and the electricity is outputted by the current collector layers. Hence, by this new structure of the electricity supply element, the resistance is decreased.