Patents by Inventor Prosanto Mukerji

Prosanto Mukerji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5863970
    Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.
    Type: Grant
    Filed: February 4, 1997
    Date of Patent: January 26, 1999
    Assignees: Polyset Company, Inc., Motorola, Inc.
    Inventors: Ramkrishna Ghoshal, Prosanto Mukerji