Patents by Inventor Pu-Chen Yeh

Pu-Chen Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dummy die placement without backside chipping
    Patent number: 11990429
    Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu
  • Adjustable bubble bend
    Patent number: 5098614
    Abstract: The present invention relates to an adjustment bubble bend. The structure of the adjustable bubble bend allows the user to control the volume of the bubbles produced by the device and to reduce the noise emitted from the device during operation.
    Type: Grant
    Filed: January 14, 1991
    Date of Patent: March 24, 1992
    Inventors: Chiu-Tseng L. Yeh, Pu-Chen Yeh