Abstract: A capacitive coupling package structure includes a plurality of first leads, a plurality of second leads, two first coupling plates, two second coupling plates, a first chip, a second chip, a first package member, and a second package member. The two first coupling plates and the two second coupling plates are vertically separate from each other and are partially and vertically overlapped with each other, respectively.

Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

Abstract: The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.

Abstract: A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.

Abstract: The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.