Patents by Inventor Pu WEN

Pu WEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170049007
    Abstract: A meshed cooling structure includes a cooling mesh and a thermally conductive component. The cooling mesh includes a plurality of mesh layers. Each mesh layer includes a plurality of cooling wires which are interlaced, and each cooling wire of each mesh layer has a caliber different from one another. The thermally conductive component supports and transfers heat to the cooling mesh. The thermally conductive component includes a base and a plurality of supporting bodies spaced side by side. A supporting height is formed between one side of each supporting body and the other side opposite to the one side. The one side of each supporting body supports and in contact with the cooling mesh. The other side of each supporting body is connected to the base. Each cooling wire and each supporting body are opposite to each other obliquely.
    Type: Application
    Filed: December 29, 2015
    Publication date: February 16, 2017
    Inventors: Chih-Hung WEI, Ming-Chang WU, Jian-Yang WU, Pu WEN, Chih-Yang HSU