Patents by Inventor Pu Wu
Pu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958813Abstract: A uracil compound containing a carboxylate fragment, a preparation method therefor, and a herbicidal composition and use thereof are provided. The preparation method includes a contact reaction between a carboxylic acid compound and different substituted alcohol, halogenated, or sulfonate compound in a presence of a solvent. The uracil compound containing a carboxylate fragment provided by the present invention has better herbicidal activity compared with the prior art.Type: GrantFiled: February 5, 2022Date of Patent: April 16, 2024Assignee: JIANGSU FLAG CHEMICAL INDUSTRY CO., LTD.Inventors: Pu Zhang, Kaicheng Yao, Yaojun Wu, Dan Xu, Pin Qian, Long Bu, Congqiang Bai
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Publication number: 20240054620Abstract: An image processing method, an electronic device, and a non-transitory computer readable storage medium are provided. The method includes: dividing a to-be-processed image into blocks to obtain a plurality of image blocks. Each image block includes an effective image area and an extended area. The method further includes processing image data of each image block by using a target network model to obtain each target image block. The method also includes extracting target effective image areas in each target image block separately. The method additionally includes combining the target effective image areas to generate a target image.Type: ApplicationFiled: October 26, 2023Publication date: February 15, 2024Applicant: VIVO MOBILE COMMUNICATION CO., LTD.Inventor: Pu WU
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Patent number: 11754095Abstract: A pump front chamber automatic compensation device for improving closed impeller backflow is provided. The automatic compensation device is mounted on the inner wall surface of the pump body front chamber, extending from the inner wall surface of the pump body front chamber to the impeller front cover plate, stopping the flow of fluid from the impeller outlet to the pump front chamber. The automatic compensation device includes a spacer plate and a compensation feedback device. One end of the spacer plate extends into the pump front chamber, and the other end is connected to the automatic compensation assembly, through which the length of the spacer extension is automatically compensated. The pump front chamber automatic compensation device can prevent the fluid flowing out of the impeller outlet from entering the front chamber of the centrifugal pump, thus improving the operating efficiency and stability of the centrifugal pump.Type: GrantFiled: July 22, 2021Date of Patent: September 12, 2023Assignee: JIANGSU UNIVERSITYInventors: Wei Li, Lei Wang, Ling Zhou, Yong Zhu, Hao Chang, Qi Chen, Pu Wu
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Publication number: 20230077761Abstract: A light-emitting device includes a substrate, a semiconductor structure, and an insulating reflective layer. The substrate has an upper surface and a lower surface. The semiconductor structure is disposed on the upper surface of the substrate. A projection of the semiconductor structure on the upper surface of the substrate has an outer periphery spaced apart a distance from an outer periphery of the upper surface of the substrate. The insulating reflective layer covers at least a part of the semiconductor structure and has an extending portion extending outwardly from the semiconductor structure and covering a part of the upper surface of the substrate. A peripheral end of the extending portion of the insulating reflective layer has an inclined lateral surface, and an included angle defined between the inclined lateral surface and the upper surface of the substrate is not less than 60°.Type: ApplicationFiled: September 12, 2022Publication date: March 16, 2023Inventors: Chung-Ying CHANG, Yi-Jui HUANG, Tsung-Ming LIN, Kunta HSIEH, Ji-Pu WU, Yu-Tsai TENG
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Publication number: 20220356888Abstract: A pump front chamber automatic compensation device for improving closed impeller backflow is provided. The automatic compensation device is mounted on the inner wall surface of the pump body front chamber, extending from the inner wall surface of the pump body front chamber to the impeller front cover plate, stopping the flow of fluid from the impeller outlet to the pump front chamber. The automatic compensation device includes a spacer plate and a compensation feedback device. One end of the spacer plate extends into the pump front chamber, and the other end is connected to the automatic compensation assembly, through which the length of the spacer extension is automatically compensated. The pump front chamber automatic compensation device can prevent the fluid flowing out of the impeller outlet from entering the front chamber of the centrifugal pump, thus improving the operating efficiency and stability of the centrifugal pump.Type: ApplicationFiled: July 22, 2021Publication date: November 10, 2022Applicant: JIANGSU UNIVERSITYInventors: Wei LI, Lei WANG, Ling ZHOU, Yong ZHU, Hao CHANG, Qi CHEN, Pu WU
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Patent number: 11450596Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: GrantFiled: November 22, 2019Date of Patent: September 20, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
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Publication number: 20220158040Abstract: A light-emitting diode includes a semiconductor light-emitting stack and a distributed Bragg reflector (DBR) structure. The semiconductor light-emitting stack has a first surface and a second surface opposite to each other. The DBR structure is disposed on one of the first surface and the second surface of the semiconductor light-emitting stack, and includes at least one set of first light-transmitting layers and at least one set of second light-transmitting layers stacked on each other in the first direction. The first light-transmitting layers has interface roughness greater than that of the second light-transmitting layers.Type: ApplicationFiled: January 28, 2022Publication date: May 19, 2022Applicant: QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD.Inventors: Hongbin TANG, Yu-Tsai TENG, Yaowei CHUANG, Ji-pu WU, Chiawen WU, Wen-Chia HUANG, Chung-Ying CHANG
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Publication number: 20210313488Abstract: A composite reflective structure includes at least one dielectric multilayer element which includes a first dielectric layer having a first refractive index, a second dielectric layer having a second refractive index, and a stress buffer layer interposed therebetween. The first refractive index is greater than the second refractive index. Also disclosed herein is a light-emitting diode chip including the abovementioned composite reflective structure and a light-emitting diode device including the light-emitting diode chip.Type: ApplicationFiled: June 16, 2021Publication date: October 7, 2021Inventors: Chung-Ying Chang, Ji-Pu Wu, Hongbin Tang, Qihua Liao, Yu-Tsai Teng, Chia-Hao Chang, Shutian Qiu
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Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
Patent number: 11139225Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: GrantFiled: June 14, 2019Date of Patent: October 5, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu -
Publication number: 20210159155Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: ApplicationFiled: November 22, 2019Publication date: May 27, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
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Publication number: 20210057396Abstract: The present disclosure provides a manufacturing method for an LED display screen. The method includes preparing a batch of LED chips of the same or different specification; picking up the LED chips illogically according to a random sampling method, and arranging the picked led chips in sequence; and packaging and assembling the LED chips arranged in sequence to form the LED display screen. The LED display screen includes an area which includes a plurality of LED chips, and at least two adjacent LED chips of the plurality of LED chips are of different specifications, the specification of the LED chip comprising a specification of at least one of color and brightness.Type: ApplicationFiled: November 6, 2020Publication date: February 25, 2021Inventors: Ji-Pu WU, Tsung-Ming LIN, Yu-Tsai TENG, Ho-Chia TSENG
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Publication number: 20200395275Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
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Publication number: 20120124682Abstract: The present invention provides a genetically-modified non-human animal whose somatic and germ cells contain a gene encoding an altered form of an DHX36 gene, the altered DHX36 haviang been targeted to replace a wild-type DHX36 gene into the animal or an ancestor of the animal at an embyonic stage using embryonic stem cells. An ideal use of the genetically-modified non-human animal of the invention is the use as an experimental model for muscular dystrophy, e.g. spinal muscular atrophy, to identify e.g. new treatments for muscular dystrophy and or study its pathogenesis.Type: ApplicationFiled: May 7, 2010Publication date: May 17, 2012Inventors: Janice Lai, Yoshikuni Nagamine, Pu Wu