Patents by Inventor Puay H. See

Puay H. See has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9813043
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: November 7, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 9634640
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: April 25, 2017
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 9401689
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: July 26, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Publication number: 20160204758
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Application
    Filed: March 24, 2016
    Publication date: July 14, 2016
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 9331665
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Grant
    Filed: May 6, 2013
    Date of Patent: May 3, 2016
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 9203373
    Abstract: A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: December 1, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Daeik D. Kim, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Publication number: 20140327496
    Abstract: Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) are disclosed. In one embodiment, the tunable diplexer may be formed by providing one of either a varactor or a variable inductor in the diplexer. The variable nature of the varactor or the variable inductor allows a notch in the diplexer to be tuned so as to select a band stop to eliminate harmonics at a desired frequency as well as control the cutoff frequency of the pass band. By stacking the elements of the diplexer into three dimensions, space is conserved and a variety of varactors and inductors are able to be used.
    Type: Application
    Filed: May 6, 2013
    Publication date: November 6, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Chengjie Zuo, Daeik D. Kim, Je-Hsiung Lan, Jonghae Kim, Mario Francisco Velez, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 8824976
    Abstract: A switchplexer is described. The switchplexer includes switches that are coupled to an antenna. The switchplexer also includes ports. Each of the switches is separately coupled to one of the ports. The switchplexer also includes controlling circuitry coupled to the switches. The controlling circuitry concurrently closes at least two of the switches when indicated by a control signal.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: September 2, 2014
    Assignee: QUALCOMM Incorporated
    Inventor: Puay H. See
  • Publication number: 20140197902
    Abstract: A diplexer includes a substrate having a set of through substrate vias. The diplexer also includes a first set of traces on a first surface of the substrate. The first traces are coupled to the through substrate vias. The diplexer further includes a second set of traces on a second surface of the substrate that is opposite the first surface. The second traces are coupled to opposite ends of the set of through substrate vias. The through substrate vias and the traces also operate as a 3D inductor. The diplexer also includes a capacitor supported by the substrate.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 17, 2014
    Applicant: QUALCOMM INCORPORATED
    Inventors: Chengjie Zuo, Jonghae Kim, Mario Francisco Velez, Je-Hsiung Lan, Daeik D. Kim, Changhan Yun, David F. Berdy, Robert P. Mikulka, Matthew M. Nowak, Xiangdong Zhang, Puay H. See
  • Patent number: 8718582
    Abstract: Multi-mode power amplifiers that can support multiple radio technologies and/or multiple frequency bands are described. In one exemplary design, a first linear power amplifier supporting multiple radio technologies may be used to amplify a first RF input signal (e.g., for low band) and provide a first RF output signal. A second linear power amplifier also supporting the multiple radio technologies may be used to amplify a second RF input signal (e.g., for high band) and provide a second RF output signal. Each linear power amplifier may include multiple (e.g., three) chains coupled in parallel. Each chain may be selectable to amplify an RF input signal and provide an RF output signal for a respective range of output power levels. An RF input signal may be a phase modulated signal or a quadrature modulated signal and may be pre-distorted to account for non-linearity of the power amplifier.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: May 6, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: Puay H. See, Richard M. Schierbeck, II
  • Publication number: 20130273861
    Abstract: A switchplexer is described. The switchplexer includes switches that are coupled to an antenna. The switchplexer also includes ports. Each of the switches is separately coupled to one of the ports. The switchplexer also includes controlling circuitry coupled to the switches. The controlling circuitry concurrently closes at least two of the switches when indicated by a control signal.
    Type: Application
    Filed: April 11, 2012
    Publication date: October 17, 2013
    Inventor: Puay H. See
  • Publication number: 20130260699
    Abstract: A wireless communication device configured for automatic calibration is described. The wireless communication device includes a testing load. The wireless communication device also includes a transceiver chip. The wireless communication device further includes a radio frequency connector switch that couples circuitry on the transceiver chip to one of the testing load, an external load and a radiating element.
    Type: Application
    Filed: October 4, 2012
    Publication date: October 3, 2013
    Applicant: QUALCOMM INCORPORATED
    Inventors: Udara C. Fernando, Puay H. See, Sudarsan Krishnan
  • Publication number: 20090201084
    Abstract: Multi-mode power amplifiers that can support multiple radio technologies and/or multiple frequency bands are described. In one exemplary design, a first linear power amplifier supporting multiple radio technologies may be used to amplify a first RF input signal (e.g., for low band) and provide a first RF output signal. A second linear power amplifier also supporting the multiple radio technologies may be used to amplify a second RF input signal (e.g., for high band) and provide a second RF output signal. Each linear power amplifier may include multiple (e.g., three) chains coupled in parallel. Each chain may be selectable to amplify an RF input signal and provide an RF output signal for a respective range of output power levels. An RF input signal may be a phase modulated signal or a quadrature modulated signal and may be pre-distorted to account for non-linearity of the power amplifier.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 13, 2009
    Applicant: QUALCOMM Incorporated
    Inventors: Puay H. See, Richard M. Schierbeck, II