Abstract: A method is provided to prepare a cationic transition metal catalyst, the method including the steps of: providing a disubstituted phosphine selected from the group consisting of RPH and R.sub.1 R.sub.2 PH wherein R is a divalent group selected from substituted and nonsubstituted hydrocarbon groups, R.sub.1 and R.sub.2 are independently selected from substituted and nonsubstituted hydrocarbon groups; combining the disubstituted phosphine with a salt of the formula R.sub.3 X.sub.n wherein X is a good leaving group and is a weakly coordinating anion and R.sub.3 is a substituted or nonsubstituted aliphatic hydrocarbon and n is 1, 2, or 3 to form a phosphonium salt of a formula selected from R.sub.3 (RP.sup.+ H).sub.n nX.sup.- and R.sub.3 (R.sub.1 R.sub.2 P.sup.+ H).sub.n nX.sup.- ; and combining the phosphonium salt with a transition metal salt of the formula MY.sub.m wherein M is a transition metal, and Y is the anion of a weak acid thereby forming a cationic transition metal catalyst.

Abstract: A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.

Abstract: A polyketone is provided wherein the polyketone is water soluble and curable. A method to make a such a polymer is also disclosed, the method including the steps of: providing a polyketone, the polyketone comprising 1,4-diketone units; contacting the polyketone with a diamine wherein the diamine comprises one nitrogen which is more reactive than another of the nitrogens under conditions effective to incorporate the more reactive nitrogen in the polyketone; contacting the polyketone having the diamine incorporated into the polyketone with maleic anhydride under conditions effective to react the less reactive nitrogen with the maleic anhydride; contacting the polyketone having maleic anhydride incorporated thereto with a strong base; and recovering a functionalized polyketone wherein the functionalized polyketone is water soluble and curable.

Abstract: Polymers are made from 1,3,7-octatriene or like conjugated polyenes and a crosslinking agent having at least 2 activated double bonds such as ethylene glycol dimethacrylate. These polymers can be used to make absorbent foams that are useful in absorbent articles such as diapers, as well as latexes that are useful as binders and adhesives.

Abstract: A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.

Abstract: Relatively low molecular weight Olefin/CO copolymers are graft copolymerized with vinyl monomers by the exposure of a mixture of a dispersion of the two to high energy radiation such as .gamma. ray radiation. Styrene is an example of a monomer useful in forming the graft copolymer. The graft copolymers are useful as waterborne glues particularly in the preparation of wood composites.

Abstract: Polymers are made from 1,3,7-octatriene or like conjugated polyenes and a crosslinking agent having at least 2 activated double bonds such as ethylene glycol dimethacrylate. These polymers can be used to make absorbent foams that are useful in absorbent articles such as diapers, as well as latexes that are useful as binders and adhesives.

Abstract: A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

Abstract: Biodegradable and/or compostable polymers are made from isoprene, 2,3-dimethyl-1,3-butadiene or like conjugated dienes and a crosslinking agent having a cleavable linking group such as ethylene glycol dimethacrylate. These polymers can be used to make absorbent foams that are useful in absorbent articles such as diapers, as well as other biodegradable articles such as films, and latexes useful as binders and adhesives.

Abstract: A semiconductor device is attached to a supporting substrate by a plurality of solder connections that extend from the supporting substrate to the semiconductor device and the gap between the supporting substrate and the semiconductor device is filled with a reworkable composition comprising:(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one filler present in an amount from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable semiconductor assembly.

Abstract: An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including:(a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and(b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.

Abstract: A process is provided for the production of a porous crosslinked polymeric foam comprising the steps of: (a) providing a first water-in-oil emulsion comprising (i) a first mixture of polymerizable monomers comprising at least one oil-soluble vinyl monomer and from about 2 to about 70 weight percent, based on the mixture, of a multifunctional unsaturated crosslinking monomer, (ii) at least 70 weight percent, based on the emulsion, of water as the internal phase (iii) an effective amount to produce the water-in-oil emulsion of a first surfactant, and (iv) a first polymerization initiator; (b) providing a second water-in-oil emulsion comprising (i) a mixture of polymerizable monomers comprising at least one oil-soluble vinyl monomer and from about 2 to about 70 weight percent, based on the mixture, of a second multifunctional unsaturated crosslinking monomer, (ii) at least 70 weight percent, based on the emulsion, of water as the internal phase (iii) an effective amount to produce the water-in-oil emulsion of a

Abstract: Novel heat-curable elastomeric polymers comprise an elastomeric base polymer modified by the presence on the elastomeric base polymer molecule of at least one pendant carboxylic acid ester group wherein the ester moiety is alkyl arylcyclobutene. In a preferred embodiment, the base polymer is a selectively hydrogenated block copolymer of the poly-(vinylaromatic compound)/polyalkadiene type, and the ester moiety is methylbenzocyclobutene.

Abstract: Ring-arylcyclobutenealkylated di(hydroxyphenyl) compounds having at least one arylcyclobutenealkyl moiety attached to at least one of the phenyl rings self-cure upon heating to produce rigid, relatively insoluble resins of the thermoset type.

Abstract: Novel, self-curing resins are produced by di(hydroxyphenyl) compound and an arylcyclobutenealkyl compound. The resulting di(hydroxyphenyl) compound (di(arylcyclobutenealkyl) ethers cure upon heating to produce rigid thermosets of relatively high glass transition temperature and heat stability.