Patents by Inventor Pui Ling Yee

Pui Ling Yee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9013202
    Abstract: A metal-to-metal leakage and breakdown testing structure for semiconductor structures and method of using the testing structure is disclosed. The testing structure includes plurality of resistor bridges connected to respective two terminal devices. The testing structure further includes a plurality of switches each having a voltage node provided between resistors of a respective one of the plurality of resistor bridges. The voltage node is read at a circuit pad when a respective one of the plurality of switches is in an on state. The testing structure further includes a device turning on and off each of the plurality of switches, individually.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Fen Chen, Kai Di Feng, Pui Ling Yee
  • Publication number: 20130314119
    Abstract: A metal-to-metal leakage and breakdown testing structure for semiconductor structures and method of using the testing structure is disclosed. The testing structure includes plurality of resistor bridges connected to respective two terminal devices. The testing structure further includes a plurality of switches each having a voltage node provided between resistors of a respective one of the plurality of resistor bridges. The voltage node is read at a circuit pad when a respective one of the plurality of switches is in an on state. The testing structure further includes a device turning on and off each of the plurality of switches, individually.
    Type: Application
    Filed: May 23, 2012
    Publication date: November 28, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Fen Chen, Kai Di Feng, Pui Ling Yee