Patents by Inventor Pui-Ren JIANG

Pui-Ren JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method thereof
    Patent number: 9526179
    Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: December 20, 2016
    Assignee: MUTUAL-TEK INDUSTRIES CO., LTD.
    Inventors: Chiu Yu Chen, Wen-Chin Lai, Pui-Ren Jiang, Hsu-Tung Chen
  • PRINTED CIRCUIT BOARD AND METHOD THEREOF
    Publication number: 20150257267
    Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.
    Type: Application
    Filed: March 2, 2015
    Publication date: September 10, 2015
    Inventors: Chiu Yu CHEN, Wen-Chin LAI, Pui-Ren JIANG, Hsu-Tung CHEN