Patents by Inventor Pui Yin Yu

Pui Yin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170142829
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.
    Type: Application
    Filed: January 13, 2016
    Publication date: May 18, 2017
    Applicant: Multek Technologies Limited
    Inventors: Pui Yin Yu, Mark Zhang, Jiawen Chen
  • Publication number: 20170142828
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.
    Type: Application
    Filed: January 13, 2016
    Publication date: May 18, 2017
    Applicant: Multek Technologies Limited
    Inventors: Pui Yin Yu, Mark Zhang, Jiawen Chen
  • Publication number: 20160278208
    Abstract: A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is applied to a conductive layer of an inner core and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the plug non-conductive layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.
    Type: Application
    Filed: August 24, 2015
    Publication date: September 22, 2016
    Inventors: Kwan Pen, Pui Yin Yu
  • Publication number: 20160278207
    Abstract: A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is plugged into an inner core through hole and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the inner core layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.
    Type: Application
    Filed: August 24, 2015
    Publication date: September 22, 2016
    Inventors: Kwan Pen, Pui Yin Yu