Patents by Inventor Puneet Narendra JAWALI
Puneet Narendra JAWALI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11951590Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.Type: GrantFiled: June 14, 2021Date of Patent: April 9, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Ashwin Chockalingam, Jason Garcheung Fung, Veera Raghava Reddy Kakireddy, Nandan Baradanahalli Kenchappa, Puneet Narendra Jawali, Rajeev Bajaj
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Publication number: 20240025009Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.Type: ApplicationFiled: October 5, 2023Publication date: January 25, 2024Inventors: Aniruddh Jagdish KHANNA, Jason G. FUNG, Puneet Narendra JAWALI, Rajeev BAJAJ, Adam Wade MANZONIE, Nandan BARADANAHALLI KENCHAPPA, Veera Raghava Reddy KAKIREDDY, Joonho AN, Jaeseok KIM, Mayu YAMAMURA
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Publication number: 20240025010Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.Type: ApplicationFiled: October 3, 2023Publication date: January 25, 2024Inventors: Puneet Narendra JAWALI, Nandan BARADANAHALLI KENCHAPPA, Jason G. FUNG, Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE, Rajeev BAJAJ, Adam Wade MANZONIE, Andrew Scott LAWING
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Patent number: 11878389Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.Type: GrantFiled: February 10, 2021Date of Patent: January 23, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Puneet Narendra Jawali, Veera Raghava Reddy Kakireddy, Rajeev Bajaj, Daniel Redfield
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Patent number: 11813712Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.Type: GrantFiled: September 29, 2020Date of Patent: November 14, 2023Assignee: Applied Materials, Inc.Inventors: Aniruddh Jagdish Khanna, Jason G. Fung, Puneet Narendra Jawali, Rajeev Bajaj, Adam Wade Manzonie, Nandan Baradanahalli Kenchappa, Veera Raghava Reddy Kakireddy, Joonho An, Jaeseok Kim, Mayu Yamamura
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Patent number: 11806829Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.Type: GrantFiled: June 19, 2020Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Puneet Narendra Jawali, Nandan Baradanahalli Kenchappa, Jason G. Fung, Shiyan Akalanka Jayanath Wewala Gonnagahadeniyage, Rajeev Bajaj, Adam Wade Manzonie, Andrew Scott Lawing
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Publication number: 20220395958Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.Type: ApplicationFiled: June 14, 2021Publication date: December 15, 2022Inventors: Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE, Ashwin CHOCKALINGAM, Jason Garcheung FUNG, Veera Raghava Reddy KAKIREDDY, Nandan BARADANAHALLI KENCHAPPA, Puneet Narendra JAWALI, Rajeev BAJAJ
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Publication number: 20220250203Abstract: Embodiments of the present disclosure generally relate to structures formed using an additive manufacturing process, and more particularly, to polishing pads, and methods for manufacturing polishing pads, which may be used in a chemical mechanical polishing (CMP) process. The structures described herein are formed from a plurality of printed layers. The structure comprises a first material domain having a first material composition and a plurality of second material domains having a second material composition different from the first material composition. The first material domain is configured to have a first rate of removal and the plurality of second material domains are configured to have a different second rate of removal when an equivalent force is applied to a top surface of the first material domain and the plurality of second material domains.Type: ApplicationFiled: February 10, 2021Publication date: August 11, 2022Inventors: Puneet Narendra JAWALI, Veera Raghava Reddy KAKIREDDY, Rajeev BAJAJ, Daniel REDFIELD
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Publication number: 20210394333Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.Type: ApplicationFiled: June 19, 2020Publication date: December 23, 2021Inventors: Puneet Narendra JAWALI, Nandan BARADANAHALLI KENCHAPPA, Jason G. FUNG, Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE, Rajeev BAJAJ, Adam Wade MANZONIE, Andrew Scott LAWING
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Publication number: 20210187693Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.Type: ApplicationFiled: September 29, 2020Publication date: June 24, 2021Inventors: Aniruddh Jagdish KHANNA, Jason G. FUNG, Puneet Narendra JAWALI, Rajeev BAJAJ, Adam Wade MANZONIE, Nandan BARADANAHALLI KENCHAPPA, Veera Raghava Reddy KAKIREDDY, Joonho AN, Jaeseok KIM, Mayu YAMAMURA