Patents by Inventor Punit Tiwari

Punit Tiwari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10296682
    Abstract: A system and method for extracting relevant computational data are disclosed. In one embodiment, one or more physical quantities and/or one or more functions of physical quantities of interest, associated with a larger volume, to be measured are identified. Further, any non-available identified functions of physical quantities are computed for each smaller volume of the larger volume using the available physical quantities in the computational data. Furthermore, regions in computational domain are identified along with ranges of identified physical quantities and functions of physical quantities of interest for carrying out the extraction from the computational data. Moreover, geometrical and connectivity information of smaller volumes associated with the identified regions/ranges that are obtained by filtering the computational data associated with the larger volume are obtained.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: May 21, 2019
    Assignee: AIRBUS GROUP INDIA PRIVATE LIMITED
    Inventors: Punit Tiwari, Shreesh Mishra
  • Patent number: 10161812
    Abstract: A technique for performing thermal analysis of an electronics rack is disclosed. In one embodiment, the electronics rack having multiple heat generating components is modeled. Further, thermal boundary conditions for each of the heat generating components are computed, by a computation fluid dynamics tool (CFD) tool, based on an initial temperature and a heat flux corresponding to each of the heat generating components in a first cycle, upon modeling the electronics rack. Furthermore, an actual temperature of each of the heat generating components is determined, by a one dimensional (1D) tool, using the computed thermal boundary conditions for estimating heat dissipated by each of the heat generating components in the first cycle.
    Type: Grant
    Filed: May 7, 2016
    Date of Patent: December 25, 2018
    Assignee: AIRBUS GROUP INDIA PRIVATE LIMITED
    Inventors: Punit Tiwari, Krishan Chugh, Tim Giese
  • Publication number: 20160327437
    Abstract: A technique for performing thermal analysis of an electronics rack is disclosed. In one embodiment, the electronics rack having multiple heat generating components is modeled. Further, thermal boundary conditions for each of the heat generating components are computed, by a computation fluid dynamics tool (CFD) tool, based on an initial temperature and a heat flux corresponding to each of the heat generating components in a first cycle, upon modeling the electronics rack. Furthermore, an actual temperature of each of the heat generating components is determined, by a one dimensional (1D) tool, using the computed thermal boundary conditions for estimating heat dissipated by each of the heat generating components in the first cycle.
    Type: Application
    Filed: May 7, 2016
    Publication date: November 10, 2016
    Inventors: PUNIT TIWARI, KRISHAN CHUGH, TIM GIESE
  • Patent number: 9396296
    Abstract: A system and method for computing thermal boundary conditions from an unstructured computational fluid dynamics (CFD) simulation for a thermal simulation of a structural component are disclosed. The thermal boundary conditions include convective heat transfer coefficient (HTC) and reference temperature (Tref). In one embodiment, prism cells are formed to capture boundary layer substantially next to a wall of the structural component. Further, tetrahedral cells are formed to capture a diffused temperature layer substantially next to the formed last prism cell and in a direction normal to the wall. Furthermore, temperature of each of the prism cells is computed in the direction normal to the wall until a substantially first tetrahedral cell. In addition, the computed temperature of the prism cell that is substantially adjacent to the first tetrahedral cell is declared as the Tref. Also, the HTC is computed using the obtained Tref.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: July 19, 2016
    Assignee: AIRBUS ENGINEERING CENTRE INDIA
    Inventors: Vikram Singh Mangat, Jose-Angel Hernanz Manrique, Madhusudana Reddy, Punit Tiwari, Shreesh Mishra, Sunil Kumar, Sandhya Jha
  • Publication number: 20150242539
    Abstract: A system and method for computing design parameters for a thermally comfortable environment is disclosed. In one embodiment, a surface heat transfer coefficient (hcal) is obtained for each body part of one or more thermal manikins in a uniform thermal environment by performing a 1D numerical analysis on the uniform thermal environment based on a given set of boundary conditions for the uniform thermal environment. Further, equivalent temperature (teq) limits for each body part corresponding to the thermal comfort limits are obtained from known design standards. Furthermore, heat flux limits (q_t limits) are obtained for each body part using associated teq limits and the hcal. In addition, the design parameters are computed by performing 1D numerical analysis on a non-uniform thermal environment, including one or more thermal manikins, based on a given set of boundary conditions for the non-uniform thermal environment and the obtained q_t limits.
    Type: Application
    Filed: August 5, 2013
    Publication date: August 27, 2015
    Inventors: Punit Tiwari, Arun Rajput, Madhusudhana Reddy
  • Publication number: 20140222389
    Abstract: A system and method for extracting relevant computational data are disclosed. In one embodiment, one or more physical quantities and/or one or more functions of physical quantities of interest, associated with a larger volume, to be measured are identified. Further, any non-available identified functions of physical quantities are computed for each smaller volume of the larger volume using the available physical quantities in the computational data. Furthermore, regions in computational domain are identified along with ranges of identified physical quantities and functions of physical quantities of interest for carrying out the extraction from the computational data. Moreover, geometrical and connectivity information of smaller volumes associated with the identified regions/ranges that are obtained by filtering the computational data associated with the larger volume are obtained.
    Type: Application
    Filed: January 29, 2014
    Publication date: August 7, 2014
    Applicant: AIRBUS ENGINEERING CENTRE INDIA
    Inventors: PUNIT TIWARI, Shreesh Mishra
  • Patent number: 8407032
    Abstract: A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (hcal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q?T) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (teq) of each body part of the one or more thermal manikins using the obtained associated hcal, the obtained associated q?T, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed teq.
    Type: Grant
    Filed: June 10, 2010
    Date of Patent: March 26, 2013
    Assignee: Airbus Engineering Centre India
    Inventors: Punit Tiwari, Madhusudhana Reddy, Andreas Wick
  • Publication number: 20130060541
    Abstract: A system and method for computing thermal boundary conditions from an unstructured computational fluid dynamics (CFD) simulation for a thermal simulation of a structural component are disclosed. The thermal boundary conditions include convective heat transfer coefficient (HTC) and reference temperature (Tref). In one embodiment, prism cells are formed to capture boundary layer substantially next to a wall of the structural component. Further, tetrahedral cells are formed to capture a diffused temperature layer substantially next to the formed last prism cell and in a direction normal to the wall. Furthermore, temperature of each of the prism cells is computed in the direction normal to the wall until a substantially first tetrahedral cell. In addition, the computed temperature of the prism cell that is substantially adjacent to the first tetrahedral cell is declared as the Tref. Also, the HTC is computed using the obtained Tref.
    Type: Application
    Filed: August 23, 2012
    Publication date: March 7, 2013
    Inventors: VIKRAM SINGH MANGAT, Jose-Angel Hernanz Manrique, Madhusudana Reddy, Punit Tiwari, Shreesh Mishra, Sunil Kumar, Sandhya Jha
  • Publication number: 20120298337
    Abstract: A method and apparatus for radiative heat transfer augmentation for aviation electronic equipments cooled by forced and/or natural convection are disclosed. In one embodiment, the apparatus includes a first heat dissipation device to dissipate heat from the aviation electronic equipments housed in an aviation electronic equipment rack using forced convection. Further, the apparatus includes a second heat dissipation device to enhance heat dissipation from the aviation electronic equipments by radiation and natural convection. Furthermore, the second heat dissipation device is strategically disposed with respect to aircraft skin and configured to maximize radiative view factor.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 29, 2012
    Inventors: Punit Tiwari, Shreesh Mishra
  • Publication number: 20110015908
    Abstract: A system and method for assessing thermal comfort in an enclosure is disclosed. In one embodiment, a method includes performing a numerical analysis on a calibration enclosure including a thermal manikin in a uniform thermal environment to obtain a surface heat transfer coefficient (hcal) for each body part of the thermal manikin. The method also includes performing a numerical analysis on an enclosure including one or more thermal manikins in a non-uniform thermal environment to obtain a total heat flux (q?T) for each body part of the one or more thermal manikins. The method further includes computing an equivalent temperature (teq) of each body part of the one or more thermal manikins using the obtained associated hcal, the obtained associated q?T, and an associated surface temperature of the body part. Furthermore, the method includes evaluating thermal comfort in the enclosure based on each computed teq.
    Type: Application
    Filed: June 10, 2010
    Publication date: January 20, 2011
    Inventors: Punit TIWARI, Madhusudhana REDDY, Andreas WICK